BS EN 61189-2:1997:2001 Edition
$215.11
Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Test methods for materials for interconnection structures
| Published By | Publication Date | Number of Pages |
| BSI | 2001 | 88 |
| Status | Withdrawn |
|---|---|
| Title | Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Test methods for materials for interconnection structures |
| Corrects | BS EN 61189-2:1997 |
| Publisher | BSI |
| Committee | EPL/501 |
| Pages | 88 |
| Publication Date | 2001-03-15 |
| Withdrawn Date | 2009-09-01 |
| Replaced By | BS EN 61189-2:2006 |
| ISBN | 0 580 27849 2 |
| Standard Number | BS EN 61189-2:1997, IEC 61189-2:1997 |
| Identical National Standard Of | IEC 61189-2:1997/AMD1:2000 |
| Descriptors | Flow measurement, Printed circuits, Volatile matter determination, Chemical analysis and testing, Blistering, Resistance measurement, Compressible flow, Electrical testing, Electrical resistivity, Electrodes, Electronic equipment and components, Electrical insulating materials, Thermal testing, Plastics, Sodium hydroxide, Test specimens, Accuracy, Precision, Pull-out tests, Testing conditions, Chemical-resistance tests, Gelation, Peeling tests, Test equipment, Printed-circuit boards, Position, High-temperature testing, Thermal-shock tests, Impregnated materials, Time, Cleaning, Determination of content, Electric arcs |
| ICS Codes | 31.190 - Electronic component assemblies |
