BS EN IEC 60947-7-4:2019
$167.15
Low-voltage switchgear and controlgear – Ancillary equipment. PCB terminal blocks for copper conductors
| Published By | Publication Date | Number of Pages |
| BSI | 2019 | 44 |
IEC 60947-7-4:2019 is available as /2 which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 60947-7-4:2019 specifies requirements for PCB terminal blocks primarily intended for industrial or similar use. Mounting and fixing on the printed circuit board is made by soldering, press-in or equivalent methods to provide electrical and mechanical connection between copper conductors and the printed circuit board. This document applies to PCB terminal blocks intended to connect copper conductors, with or without special preparation, having a cross-section between 0,08 mm2 and 300 mm2 (AWG 28-600 kcmil), intended to be used in circuits of a rated voltage not exceeding 1 000 V AC up to 1 000 Hz or 1 500 V DC. This second edition cancels and replaces the first edition published in 2013. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: a) additional test for PCB terminal blocks with clamping units, where contact pressure is transmitted through insulating materials; b) tightening torques for screws now given in Table 4 of this document (previously given in Table 4 of IEC 60947-1:2007); tightening torques added for an additional type of screw; c) new criteria for verification of contact resistance introduced; d) clarification in the description of the temperature-rise test (current-temperature derating); corrections in the test sequence according to Figure 4.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 2 | undefined |
| 5 | Annex ZA(normative)Normative references to international publicationswith their corresponding European publications |
| 9 | English CONTENTS |
| 11 | FOREWORD |
| 13 | INTRODUCTION |
| 14 | 1 Scope 2 Normative references |
| 16 | 3 Terms and definitions |
| 17 | 4 Classification 5 Characteristics 5.1 Summary of characteristics 5.2 Type of PCB terminal block 5.3 Rated and limiting values 5.3.1 Rated voltages |
| 18 | 5.3.2 Rated current 5.3.3 Standard cross-sections Tables Table 1 – Standard cross-sections of copper conductors |
| 19 | 5.3.4 Maximum cross-section 5.3.5 Connecting capacity Table 2 – Relationship between maximum cross-section and connecting capacity of PCB terminal blocks |
| 20 | 6 Product information 6.1 Marking 6.2 Additional information 7 Normal service, mounting and transport conditions 8 Constructional and performance requirements 8.1 Constructional requirements 8.1.1 Clamping units |
| 21 | 8.1.2 Mounting and installation 8.1.3 Clearances and creepage distances 8.1.4 Terminal identification and marking Table 3 – Standards for clamping units and connecting methods |
| 22 | 8.1.5 Resistance to abnormal heat and fire 8.1.6 Maximum cross-section and connecting capacity 8.2 Performance requirements 8.2.1 Temperature-rise (current-temperature derating) 8.2.2 Dielectric properties 8.2.3 Short-time withstand current |
| 23 | 8.2.4 Contact resistance 8.2.5 Ageing tests 8.3 Electromagnetic compatibility (EMC) 9 Tests 9.1 Kinds of test 9.2 General |
| 24 | 9.3 Verification of mechanical characteristics 9.3.1 General 9.3.2 Attachment of the PCB terminal block on its support |
| 25 | 9.3.3 Vacant 9.3.4 Verification of the maximum cross-section and connecting capacity 9.3.5 Verification of maximum cross-section (special test with gauges) Table 4 – Tightening torques for PCB terminal blocks with screw-type clamping units |
| 26 | 9.4 Verification of electrical characteristics 9.4.1 General 9.4.2 Verification of clearances and creepage distances 9.4.3 Dielectric tests |
| 27 | 9.4.4 Verification of contact resistance Table 5 – Impulse withstand test voltages Table 6 – Dielectric test voltages corresponding to the rated insulation voltage |
| 29 | 9.4.5 Temperature-rise test (current-temperature derating) Figures Figure 1 – Test assembly for the measurement ofcontact resistance and temperature-rise |
| 30 | Figure 2 – Example of wiring structure of a multi-tier PCB terminal block Table 7 – Length of connectable conductors and conductor loops |
| 31 | 9.4.6 Short-time withstand current test Table 8 – Examples of cross-sectional distribution of interconnections on printed circuit boards |
| 32 | 9.4.7 Ageing tests Figure 3 – Test assembly for the measurement of short-time withstand current |
| 33 | Figure 4 – Test sequence |
| 34 | Figure 5 – Test sequence for PCB terminal blockswith contact pressure via insulating material |
| 36 | 9.5 Verification of thermal characteristics Figure 6 – Current cycling ageing test procedure |
| 37 | 9.6 Verification of EMC characteristics 9.6.1 General 9.6.2 Immunity 9.6.3 Emission |
| 38 | Annex A (informative) Structure of a PCB terminal block Figure A.1 – Structure of a PCB terminal block |
| 39 | Annex B (informative) Additional information to be specified between the manufacturer and the user B.1 Additional information available on request of the user B.2 Information for testing in addition to those mentioned above |
| 40 | Annex C (informative) Examples of PCBs and PCB terminal blocks for high-current application C.1 Layout of high-current PCBs (schematic diagram) Figure C.1 – Structure of a high current PCB |
| 41 | C.2 High-current PCB terminal blocks Figure C.2 – PCB terminal block with soldered connection to the PCB Figure C.3 – PCB terminal block with screwed connection to the PCB |
| 42 | Bibliography |
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