BSI PD ES 59008-3:1999
$86.31
Data requirements for semiconductor die – Mechanical, material and connectivity requirements
| Published By | Publication Date | Number of Pages |
| BSI | 1999 | 14 |
Specifies requirements for the exchange of data pertaining to bare semiconductor die, with or without connection structures, and minimally-packaged semiconductor die. Also gives recommendations for general industry good practice in its use.
