BSI PD IEC TR 63141:2020
$198.66
Damp heat, steady state (unsaturated pressurized vapour with air)
Published By | Publication Date | Number of Pages |
BSI | 2020 | 60 |
This document describes a new test method to control the volume of air injected into a conventional HAST chamber filled with water vapour. This document provides an overview of the conventional HAST chamber, an overview of the air-HAST equipment where air is incorporated into the HAST chamber, an example of an air-HAST test apparatus, and application examples of air-HAST.
PDF Catalog
PDF Pages | PDF Title |
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2 | undefined |
4 | CONTENTS |
7 | FOREWORD |
9 | INTRODUCTION |
10 | 1 Scope 2 Normative references 3 Terms and definitions |
11 | 4 Overview of HAST and air-HAST 4.1 Overview of HAST chamber 4.1.1 Structure of HAST chamber Figures Figure 1 – Two types of HAST equipment and their structures |
12 | 4.1.2 Definition of humidity |
13 | Figure 2 – Image of air vent process Figure 3 – Saturated test |
14 | 4.2 Structure of air-HAST equipment 4.2.1 General Figure 4 – Unsaturated test |
15 | Figure 5 – Structure of two-vessel type air-HAST chamber |
16 | 4.2.2 Air concentration and relative humidity 5 Evaluation of tin whisker growth from lead-free plating and solder-joints 5.1 Whisker of lead-free solder (comb-type substrate) 5.1.1 General Figure 6 – Structure of one-vessel type air-HAST chamber |
17 | 5.1.2 Summary of evaluation results of solder-joint whisker growth [3] [4] Figure 7 – Example of test vehicle with comb pattern Tables Table 1 – Test conditions |
18 | Figure 8 – Process flow for sample build |
19 | Figure 9 – Temperature/relative humidity profiles of HAST and air-HAST |
20 | Table 2 – Influence of fluxes and circumstances to whisker growth Table 3 – Whisker generation in HAST |
21 | Figure 10 – Whisker generation situation in air-HAST Table 4 – Whisker generation in air-HAST |
22 | Figure 11 – Mapping of the cross-section at the solder fillet in HAST Figure 12 – Mapping of the cross-section at the solder fillet in air-HAST |
24 | Figure 13 – Arrhenius plot of the bromine-based flux Figure 14 – Reciprocal of relative humidity of whisker generation on solder |
25 | Figure 15 – Humidity properties of whisker generation on solder (pt.2) |
26 | 5.1.3 Conclusion Table 5 – Comparison of coefficients for Equations (5), (6) and (7) |
27 | 5.2 Lead-free whisker of plating (mounting substrate) 5.2.1 General 5.2.2 Test method Figure 16 – Evaluated sample |
28 | 5.2.3 Test results Table 6 – Details of evaluated samples Table 7 – Lead frames composition Table 8 – Environmental test conditions |
29 | 5.2.4 Observations Figure 17 – Whisker formation (Substrate: Cu) |
30 | Figure 18 – Cross-section inspection results with electron-imaging (Substrate: Cu) |
31 | 5.2.5 Conclusion 6 Applied case of JISSO using electrically-conductive adhesive and acceleration test under humidity environments for joining parts Figure 19 – Elements analysis |
32 | 6.1 General 6.2 Experiment method 6.2.1 Testing material 6.2.2 Test conditions Figure 20 – Substrate for conductive resistance measurement and example of component mounting Table 9 – Electrically-conductive adhesives |
33 | 6.2.3 Measurement and evaluation method 6.3 Test results 6.3.1 Experimental result Figure 21 – Humidity test conductive resistance monitor test status Table 10 – Testing material |
34 | Figure 22 – Example of the conductive resistance value change Figure 23 – Weibull plot of temperature acceleration (under fixed humidity conditions) |
35 | Figure 24 – Arrhenius plot (fixed humidity) |
36 | Figure 25 – Weibull plot of humidity acceleration (under fixed temperature conditions) |
37 | Figure 26 – Arrhenius plot (fixed temperature) Figure 27 – Eyring plot of all conditions |
38 | 6.3.2 Test result (1608R/paste A) Figure 28 – Comparison of paste (120 °C/85 % RH Air-HAST) Table 11 – Test conditions |
39 | Figure 29 – Cross-section analysis of 1608R after a humidity test (SEM image) Figure 30 – Magnified image of cross-section analysis of 1608R after a humidity test (SEM image) |
40 | 6.4 Points of attention 6.5 Summary Figure 31 – Cross-section analysis of 1608R after a humidity test (SEM image)and examples of componential analysis by EDX |
41 | 7 Applied air-HAST to c-Si PV modules evaluation tests 7.1 Background and objective 7.2 Photovoltaic module structure and deterioration factors |
42 | 7.3 Test methods 7.3.1 Crystalline silicon photovoltaic module type-approval international standard Figure 32 – Structure of c-Si PV module Table 12 – Example of failure modes of PV module via materials |
43 | 7.3.2 Air-HAST work 7.3.3 Test samples Figure 33 – Qualification test sequence in IEC 61215-1 [23] |
44 | 7.3.4 Test conditions Figure 34 – Appearance of modules Table 13 – Specifications of materials used in PV module |
45 | Table 14 – Test conditions Table 15 – Test conditions and partial pressures |
46 | 7.3.5 Measurement and analysis 7.4 Test results 7.4.1 DHT testing |
47 | Figure 35 – EL images after DHT |
48 | 7.4.2 Saturated HAST Figure 36 – Degradation profiles with DHT Figure 37 – EL images of HAST 105 °C/100 % RH |
49 | 7.4.3 Air-HAST Figure 38 – EL images after HAST 120 oC/100 % RH Figure 39 – Degradation profiles with HAST |
50 | 7.4.4 External appearance comparison Figure 40 – EL images after air-HAST Figure 41 – Degradation profiles with air-HAST |
51 | Figure 42 – Appearance of modules after each test |
52 | 7.4.5 Use of dark I-V measurement to infer deterioration factors 7.4.6 Use of ion chromatography to quantify residual acetic acid ions Figure 43 – Dark I-V |
53 | 7.5 Discussion 7.5.1 Environment test method comparisons Figure 44 – Residue of acetate ion and retention of Pmax after each test |
54 | 7.5.2 Power-loss profiles by moisture permeation 7.5.3 Comparisons by ion chromatography acetic acid quantification |
55 | 7.6 Conclusion |
56 | 8 Summary |
57 | Bibliography |