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BSI PD IEC TR 63141:2020

$198.66

Damp heat, steady state (unsaturated pressurized vapour with air)

Published By Publication Date Number of Pages
BSI 2020 60
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This document describes a new test method to control the volume of air injected into a conventional HAST chamber filled with water vapour. This document provides an overview of the conventional HAST chamber, an overview of the air-HAST equipment where air is incorporated into the HAST chamber, an example of an air-HAST test apparatus, and application examples of air-HAST.

PDF Catalog

PDF Pages PDF Title
2 undefined
4 CONTENTS
7 FOREWORD
9 INTRODUCTION
10 1 Scope
2 Normative references
3 Terms and definitions
11 4 Overview of HAST and air-HAST
4.1 Overview of HAST chamber
4.1.1 Structure of HAST chamber
Figures
Figure 1 – Two types of HAST equipment and their structures
12 4.1.2 Definition of humidity
13 Figure 2 – Image of air vent process
Figure 3 – Saturated test
14 4.2 Structure of air-HAST equipment
4.2.1 General
Figure 4 – Unsaturated test
15 Figure 5 – Structure of two-vessel type air-HAST chamber
16 4.2.2 Air concentration and relative humidity
5 Evaluation of tin whisker growth from lead-free plating and solder-joints
5.1 Whisker of lead-free solder (comb-type substrate)
5.1.1 General
Figure 6 – Structure of one-vessel type air-HAST chamber
17 5.1.2 Summary of evaluation results of solder-joint whisker growth [3] [4]
Figure 7 – Example of test vehicle with comb pattern
Tables
Table 1 – Test conditions
18 Figure 8 – Process flow for sample build
19 Figure 9 – Temperature/relative humidity profiles of HAST and air-HAST
20 Table 2 – Influence of fluxes and circumstances to whisker growth
Table 3 – Whisker generation in HAST
21 Figure 10 – Whisker generation situation in air-HAST
Table 4 – Whisker generation in air-HAST
22 Figure 11 – Mapping of the cross-section at the solder fillet in HAST
Figure 12 – Mapping of the cross-section at the solder fillet in air-HAST
24 Figure 13 – Arrhenius plot of the bromine-based flux
Figure 14 – Reciprocal of relative humidity of whisker generation on solder
25 Figure 15 – Humidity properties of whisker generation on solder (pt.2)
26 5.1.3 Conclusion
Table 5 – Comparison of coefficients for Equations (5), (6) and (7)
27 5.2 Lead-free whisker of plating (mounting substrate)
5.2.1 General
5.2.2 Test method
Figure 16 – Evaluated sample
28 5.2.3 Test results
Table 6 – Details of evaluated samples
Table 7 – Lead frames composition
Table 8 – Environmental test conditions
29 5.2.4 Observations
Figure 17 – Whisker formation (Substrate: Cu)
30 Figure 18 – Cross-section inspection results with electron-imaging (Substrate: Cu)
31 5.2.5 Conclusion
6 Applied case of JISSO using electrically-conductive adhesive and acceleration test under humidity environments for joining parts
Figure 19 – Elements analysis
32 6.1 General
6.2 Experiment method
6.2.1 Testing material
6.2.2 Test conditions
Figure 20 – Substrate for conductive resistance measurement and example of component mounting
Table 9 – Electrically-conductive adhesives
33 6.2.3 Measurement and evaluation method
6.3 Test results
6.3.1 Experimental result
Figure 21 – Humidity test conductive resistance monitor test status
Table 10 – Testing material
34 Figure 22 – Example of the conductive resistance value change
Figure 23 – Weibull plot of temperature acceleration (under fixed humidity conditions)
35 Figure 24 – Arrhenius plot (fixed humidity)
36 Figure 25 – Weibull plot of humidity acceleration (under fixed temperature conditions)
37 Figure 26 – Arrhenius plot (fixed temperature)
Figure 27 – Eyring plot of all conditions
38 6.3.2 Test result (1608R/paste A)
Figure 28 – Comparison of paste (120 °C/85 % RH Air-HAST)
Table 11 – Test conditions
39 Figure 29 – Cross-section analysis of 1608R after a humidity test (SEM image)
Figure 30 – Magnified image of cross-section analysis of 1608R after a humidity test (SEM image)
40 6.4 Points of attention
6.5 Summary
Figure 31 – Cross-section analysis of 1608R after a humidity test (SEM image)and examples of componential analysis by EDX
41 7 Applied air-HAST to c-Si PV modules evaluation tests
7.1 Background and objective
7.2 Photovoltaic module structure and deterioration factors
42 7.3 Test methods
7.3.1 Crystalline silicon photovoltaic module type-approval international standard
Figure 32 – Structure of c-Si PV module
Table 12 – Example of failure modes of PV module via materials
43 7.3.2 Air-HAST work
7.3.3 Test samples
Figure 33 – Qualification test sequence in IEC 61215-1 [23]
44 7.3.4 Test conditions
Figure 34 – Appearance of modules
Table 13 – Specifications of materials used in PV module
45 Table 14 – Test conditions
Table 15 – Test conditions and partial pressures
46 7.3.5 Measurement and analysis
7.4 Test results
7.4.1 DHT testing
47 Figure 35 – EL images after DHT
48 7.4.2 Saturated HAST
Figure 36 – Degradation profiles with DHT
Figure 37 – EL images of HAST 105 °C/100 % RH
49 7.4.3 Air-HAST
Figure 38 – EL images after HAST 120 oC/100 % RH
Figure 39 – Degradation profiles with HAST
50 7.4.4 External appearance comparison
Figure 40 – EL images after air-HAST
Figure 41 – Degradation profiles with air-HAST
51 Figure 42 – Appearance of modules after each test
52 7.4.5 Use of dark I-V measurement to infer deterioration factors
7.4.6 Use of ion chromatography to quantify residual acetic acid ions
Figure 43 – Dark I-V
53 7.5 Discussion
7.5.1 Environment test method comparisons
Figure 44 – Residue of acetate ion and retention of Pmax after each test
54 7.5.2 Power-loss profiles by moisture permeation
7.5.3 Comparisons by ion chromatography acetic acid quantification
55 7.6 Conclusion
56 8 Summary
57 Bibliography
BSI PD IEC TR 63141:2020
$198.66