1.1 This specification covers round drawn\/extruded gold wire for internal semiconductor device electrical connections. Four classifications of wire are distinguished, ( 1<\/i> ) copper-modified wire, ( 2<\/i> ) beryllium-modified wire, ( 3<\/i> ) high-strength wire, and ( 4<\/i> ) special purpose wire. Note 1Trace metallic elements have a significant effect upon the mechanical properties and thermal stability of high-purity gold wire. It is customary in manufacturing to add controlled amounts of selected impurities to gold to modify or stabilize bonding wire properties or both. This practice is known variously as ‘modifying,’ ‘stabilizing,’ or ‘doping.’ The first two wire classifications denoted in this specification refer to wire made with either of two particular modifiers, copper or beryllium, in general use. In the third and fourth wire classifications, ‘high-strength’ and ‘special purpose’ wire, the identity of modifying additives is not restricted.<\/p>\n
1.2 The values stated in SI units shall be regarded as the standard.<\/p>\n
1.2.1 A mixed system of metric and inch-pound units is in widespread use for specifying semiconductor lead-bonding wire. SI-equivalent values of other commonly used units are denoted by parentheses in text and tables.<\/p>\n
The following hazard caveat pertains only to the test method portion, Section , of this specification. This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.<\/i><\/p>\n
| PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
|---|---|---|---|---|---|---|---|
| 1<\/td>\n | Scope Referenced Documents Ordering Information Chemical Composition Mechanical Properties <\/td>\n<\/tr>\n | ||||||
| 2<\/td>\n | Dimensions and Permissible Variations Workmanship, Finish, and Appearance TABLE 1 TABLE 2 TABLE 3 TABLE 4 TABLE 5 TABLE 6 <\/td>\n<\/tr>\n | ||||||
| 3<\/td>\n | Sampling Test Methods TABLE 7 TABLE 8 <\/td>\n<\/tr>\n | ||||||
| 4<\/td>\n | Certification FIG. 1 <\/td>\n<\/tr>\n | ||||||
| 5<\/td>\n | FIG. 2 <\/td>\n<\/tr>\n | ||||||
| 6<\/td>\n | Spooling Packaging and Package Marking FIG. 3 <\/td>\n<\/tr>\n | ||||||
| 7<\/td>\n | FIG. 4 <\/td>\n<\/tr>\n | ||||||
| 8<\/td>\n | FIG. 5 <\/td>\n<\/tr>\n | ||||||
| 9<\/td>\n | FIG. 6 FIG. 7 <\/td>\n<\/tr>\n | ||||||
| 10<\/td>\n | X1. SHELF LIFE AGING TEST 1983\u20131985 X1.1 Purpose X1.2 Test Parameters TABLE 9 <\/td>\n<\/tr>\n | ||||||
| 11<\/td>\n | FIG. X1.1 <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" F72-06 Standard Specification for Gold Wire for Semiconductor Lead Bonding<\/b><\/p>\n |