This part of IEC 61967 provides a test procedure which defines an evaluation method for the near electric, magnetic or electromagnetic field components at or near the surface of an integrated circuit (IC). This diagnostic procedure is intended for IC architectural analysis such as floor planning and power distribution optimization. This test procedure is applicable to measurements on an IC mounted on any circuit board that is accessible to the scanning probe. In some cases it is useful to scan not only the IC but also its environment. For comparison of surface scan emissions between different ICs, the standardized test board defined in IEC 61967-1 should be used.<\/p>\n
This measurement method provides a mapping of the electric or magnetic near-field emissions over the IC. The resolution of the measurement is determined by the capability of the measurement probe and the precision of the probe-positioning system. This method is intended for use up to 6 GHz. Extending the upper limit of frequency is possible with existing probe technology but is beyond the scope of this specification. Measurements may be carried out in the frequency domain or in the time domain.<\/p>\n
| PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
|---|---|---|---|---|---|---|---|
| 4<\/td>\n | English \n CONTENTS <\/td>\n<\/tr>\n | ||||||
| 7<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
| 9<\/td>\n | INTRODUCTION <\/td>\n<\/tr>\n | ||||||
| 10<\/td>\n | 1 Scope 2 Normative references 3 Terms, definitions and abbreviations 3.1 Terms and definitions <\/td>\n<\/tr>\n | ||||||
| 11<\/td>\n | 3.2 Abbreviations 4 General <\/td>\n<\/tr>\n | ||||||
| 12<\/td>\n | 5 Test conditions 5.1 General 5.2 Supply voltage 5.3 Frequency range 6 Test equipment 6.1 General 6.2 Shielding 6.3 RF measuring instrument 6.4 Preamplifier <\/td>\n<\/tr>\n | ||||||
| 13<\/td>\n | 6.5 Cables 6.6 Near-field probe 6.6.1 General 6.6.2 Magnetic (H) field probe 6.6.3 Electric (E) field probe 6.6.4 Combined electric and magnetic (E\/H) field probe 6.6.5 Probe-positioning and data acquisition system <\/td>\n<\/tr>\n | ||||||
| 14<\/td>\n | 7 Test setup 7.1 General 7.2 Test configuration Figures \n Figure 1 \u2013 Example of probe-positioning system <\/td>\n<\/tr>\n | ||||||
| 15<\/td>\n | Figure 2 \u2013 One-input RF measurement setup Figure 3 \u2013 Two-input RF measurement setup with reference probe Figure 4 \u2013 Two-input RF measurement setup with reference signal <\/td>\n<\/tr>\n | ||||||
| 16<\/td>\n | 7.3 Test circuit board 7.4 Probe-positioning system software setup 7.5 DUT software 8 Test procedure 8.1 General 8.2 Ambient conditions 8.3 Operational check <\/td>\n<\/tr>\n | ||||||
| 17<\/td>\n | 8.4 Test technique <\/td>\n<\/tr>\n | ||||||
| 18<\/td>\n | 9 Test report 9.1 General 9.2 Measurement conditions 9.3 Probe design and calibration 9.4 Measurement data Figure 5 \u2013 Examples of data overlaid on an image of the DUT (Contour chart) <\/td>\n<\/tr>\n | ||||||
| 19<\/td>\n | 9.5 Post-processing 9.6 Data exchange <\/td>\n<\/tr>\n | ||||||
| 20<\/td>\n | Annex A (normative) Calibration of near-field probes A.1 General <\/td>\n<\/tr>\n | ||||||
| 21<\/td>\n | Tables \n Table A.1 \u2013 Probe factor linear units Table A.2 \u2013 Probe factor logarithmic units <\/td>\n<\/tr>\n | ||||||
| 22<\/td>\n | A.2 Test equipment A.2.1 General A.2.2 PCB with microstrip line Figure A.1 \u2013 Typical probe factor against frequency <\/td>\n<\/tr>\n | ||||||
| 23<\/td>\n | A.3 Calibration setup Figure A.2 \u2013 Microstrip line for calibration (transverse cross-section) Figure A.3 \u2013 Microstrip line for calibration (longitudinal cross-section) Table A.3 \u2013 Dimensions for 50\u00a0\uf057 microstrip <\/td>\n<\/tr>\n | ||||||
| 24<\/td>\n | A.4 Calibration procedure Figure A.4 \u2013 Probe calibration setup Figure A.5 \u2013 Scan direction across Microstrip line <\/td>\n<\/tr>\n | ||||||
| 26<\/td>\n | Figure A.6 \u2013 Typical plot of measured signal level and simulated field strength (HX) Figure A.7 \u2013 Typical plot of measured signal level and simulated field strength (Hz) <\/td>\n<\/tr>\n | ||||||
| 27<\/td>\n | Annex B (informative) Discrete electric and magnetic field probes B.1 General B.2 Probe electrical description Figure B.1 \u2013 Electric and magnetic field probe schematics <\/td>\n<\/tr>\n | ||||||
| 28<\/td>\n | B.3 Probe physical description B.3.1 General B.3.2 Electric field probe B.3.3 Magnetic field probe Figure B.2 \u2013 Example of electric field probe construction (EZ) <\/td>\n<\/tr>\n | ||||||
| 29<\/td>\n | Figure B.3 \u2013 Example of magnetic field probe construction (HX or HY) <\/td>\n<\/tr>\n | ||||||
| 30<\/td>\n | Annex C (informative) Combined electric and magnetic field probe example C.1 General C.2 Probe electrical description Figure C 1 \u2013 Electromagnetic field probe schematic <\/td>\n<\/tr>\n | ||||||
| 31<\/td>\n | C.3 Probe physical description C.4 Measurement and data acquisition system Figure C.2 \u2013 Electromagnetic field probe construction <\/td>\n<\/tr>\n | ||||||
| 32<\/td>\n | Figure C.3 \u2013 Measurement and data acquisition system overview Figure C.4 \u2013 Measurement and data acquisition system detail <\/td>\n<\/tr>\n | ||||||
| 33<\/td>\n | Annex D (informative) Coordinate systems D.1 General D.2 Cartesian coordinate system Figure D.1 \u2013 Right-hand Cartesian coordinate system (preferred) <\/td>\n<\/tr>\n | ||||||
| 34<\/td>\n | D.3 Cylindrical coordinate system Figure D.2 \u2013 Left-hand Cartesian coordinate system Figure D.3 \u2013 Cylindrical coordinate system <\/td>\n<\/tr>\n | ||||||
| 35<\/td>\n | D.4 Spherical coordinate system D.5 Coordinate system conversion Figure D.4 \u2013 Spherical coordinate system Table D.1 \u2013 Coordinate system conversion <\/td>\n<\/tr>\n | ||||||
| 36<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Integrated circuits. Measurement of electromagnetic emissions – Measurement of radiated emissions. Surface scan method<\/b><\/p>\n |