This Handbook establishes guidelines to ensure a reliable design, manufacturing and testing of high voltage electronic equipment and covers:<\/p>\n
Design<\/p>\n<\/li>\n
Manufacturing<\/p>\n<\/li>\n
Verification\/Testing<\/p>\n<\/li>\n<\/ul>\n
of equipment generating, carrying or consuming high voltage, like: high voltage power conditioner, high voltage distribution (cables and connectors).<\/p>\n
This Handbook is dedicated to all parties involved at all levels in the realization of space segment hardware and its interface with high voltage for which ECSS-E-ST-20C is applicable.<\/p>\n
This handbook sets out to:<\/p>\n
summarize most relevant aspects and data of high voltage insulation<\/p>\n<\/li>\n
provide design guidelines for high voltage insulation<\/p>\n<\/li>\n
provide design guidelines for high voltage electronic equipment<\/p>\n<\/li>\n
give an overview of appropriate high voltage test methods<\/p>\n<\/li>\n
establish a set of recommendations for generation design and verification rules and methods<\/p>\n<\/li>\n
provide best practices<\/p>\n<\/li>\n<\/ul>\n
Applicability is mainly focused on power conditioning equipment but may be also applicable for all other high voltage electric and electronic power equipment used on space missions, except items of experimental nature.<\/p>\n
| PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
|---|---|---|---|---|---|---|---|
| 2<\/td>\n | undefined <\/td>\n<\/tr>\n | ||||||
| 14<\/td>\n | 1 Scope <\/td>\n<\/tr>\n | ||||||
| 15<\/td>\n | 2 References <\/td>\n<\/tr>\n | ||||||
| 19<\/td>\n | 3 Terms, definitions and abbreviated terms <\/td>\n<\/tr>\n | ||||||
| 25<\/td>\n | 4 High voltage design considerations 4.1.1 Impact of environment 4.1.2 Pressure <\/td>\n<\/tr>\n | ||||||
| 27<\/td>\n | 4.1.3 Temperature <\/td>\n<\/tr>\n | ||||||
| 28<\/td>\n | 4.1.4 Energetic Particle Radiation <\/td>\n<\/tr>\n | ||||||
| 29<\/td>\n | 4.1.5 Space Debris and Micrometeoroids 4.1.6 Plasma <\/td>\n<\/tr>\n | ||||||
| 30<\/td>\n | 4.1.7 Mechanical 4.2.1 Categories of insulation 4.2.2 Gaseous insulation <\/td>\n<\/tr>\n | ||||||
| 33<\/td>\n | 4.2.3 Liquid insulation <\/td>\n<\/tr>\n | ||||||
| 34<\/td>\n | 4.2.4 Solid insulation <\/td>\n<\/tr>\n | ||||||
| 37<\/td>\n | 4.2.5 Vacuum insulation <\/td>\n<\/tr>\n | ||||||
| 38<\/td>\n | 4.2.6 Composites 4.3.1 Perspective <\/td>\n<\/tr>\n | ||||||
| 39<\/td>\n | 4.3.2 Electrical breakdown 4.3.2.1 Breakdown parameters 4.3.2.2 Breakdown mechanisms of gaseous insulation <\/td>\n<\/tr>\n | ||||||
| 41<\/td>\n | 4.3.2.3 Breakdown mechanisms of liquid insulation <\/td>\n<\/tr>\n | ||||||
| 42<\/td>\n | 4.3.2.4 Breakdown mechanisms of solid insulation <\/td>\n<\/tr>\n | ||||||
| 43<\/td>\n | 4.3.2.5 Breakdown mechanisms of vacuum insulation <\/td>\n<\/tr>\n | ||||||
| 45<\/td>\n | 4.3.3 Partial discharges <\/td>\n<\/tr>\n | ||||||
| 48<\/td>\n | 4.3.4 Paschen breakdown <\/td>\n<\/tr>\n | ||||||
| 50<\/td>\n | 4.3.5 Ageing 4.3.5.1 Ageing of gaseous, liquid and vacuum insulation <\/td>\n<\/tr>\n | ||||||
| 51<\/td>\n | 4.3.5.2 Ageing of solid insulation <\/td>\n<\/tr>\n | ||||||
| 56<\/td>\n | 4.4.1 DC-DC High voltage power conditioners <\/td>\n<\/tr>\n | ||||||
| 58<\/td>\n | 4.4.2 Electronic power conditioners for TWTA 4.4.2.1 Electrical power conditioner for TWTA overview <\/td>\n<\/tr>\n | ||||||
| 59<\/td>\n | 4.4.2.2 EPC design <\/td>\n<\/tr>\n | ||||||
| 60<\/td>\n | 4.4.2.3 EPC high voltage generation <\/td>\n<\/tr>\n | ||||||
| 63<\/td>\n | 4.4.2.4 High Voltage Isolation Design of a Transformer <\/td>\n<\/tr>\n | ||||||
| 65<\/td>\n | 4.4.3 Electric propulsion 4.4.3.1 Electric propulsion overview <\/td>\n<\/tr>\n | ||||||
| 67<\/td>\n | 4.4.3.2 FEEP thrusters <\/td>\n<\/tr>\n | ||||||
| 68<\/td>\n | 4.4.3.3 Plasma thrusters (Hall effect type) <\/td>\n<\/tr>\n | ||||||
| 69<\/td>\n | 4.4.3.4 Plasma thrusters (HEMP type) <\/td>\n<\/tr>\n | ||||||
| 70<\/td>\n | 4.4.3.5 Ion engines (Kaufmann type) <\/td>\n<\/tr>\n | ||||||
| 71<\/td>\n | 4.4.3.6 Ion Engines (Radio-frequency type) <\/td>\n<\/tr>\n | ||||||
| 72<\/td>\n | 4.4.4 Microwave tubes <\/td>\n<\/tr>\n | ||||||
| 75<\/td>\n | 4.4.5 Scientific instruments and experiments <\/td>\n<\/tr>\n | ||||||
| 77<\/td>\n | 5 High voltage design principles 5.1.1 Control of voltage <\/td>\n<\/tr>\n | ||||||
| 78<\/td>\n | 5.1.2 Control of electrical field strengths 5.1.2.1 Electrical Field Strengths Classifications <\/td>\n<\/tr>\n | ||||||
| 80<\/td>\n | 5.1.2.2 General control means for electrical field strength 5.1.2.3 Impact of voltage <\/td>\n<\/tr>\n | ||||||
| 81<\/td>\n | 5.1.2.4 Impact of geometry 5.1.2.5 Geometry reference case: parallel planes 5.1.2.6 Geometry reference case: spheres <\/td>\n<\/tr>\n | ||||||
| 84<\/td>\n | 5.1.2.7 Geometry reference case: cylinders <\/td>\n<\/tr>\n | ||||||
| 85<\/td>\n | 5.1.2.8 Space charges <\/td>\n<\/tr>\n | ||||||
| 88<\/td>\n | 5.1.2.9 Calculation Methods <\/td>\n<\/tr>\n | ||||||
| 89<\/td>\n | 5.1.3 Control of electrical field distribution <\/td>\n<\/tr>\n | ||||||
| 91<\/td>\n | 5.1.4 Control of insulation properties <\/td>\n<\/tr>\n | ||||||
| 94<\/td>\n | 5.1.5 Control of surface properties <\/td>\n<\/tr>\n | ||||||
| 95<\/td>\n | 5.1.6 Control of partial discharges <\/td>\n<\/tr>\n | ||||||
| 97<\/td>\n | 5.1.7 Control of corona effects 5.1.8 Control of Paschen breakdown <\/td>\n<\/tr>\n | ||||||
| 100<\/td>\n | 5.1.9 Control of triple junction effects <\/td>\n<\/tr>\n | ||||||
| 101<\/td>\n | 5.1.10 Control of creepage path <\/td>\n<\/tr>\n | ||||||
| 102<\/td>\n | 5.1.11 Control of surface charging <\/td>\n<\/tr>\n | ||||||
| 104<\/td>\n | 5.1.12 Control of interferences <\/td>\n<\/tr>\n | ||||||
| 107<\/td>\n | 5.2.1 Solid insulation: potted modules 5.2.1.1 General 5.2.1.2 Materials <\/td>\n<\/tr>\n | ||||||
| 111<\/td>\n | 5.2.1.3 Design <\/td>\n<\/tr>\n | ||||||
| 122<\/td>\n | 5.2.1.4 Potting Process <\/td>\n<\/tr>\n | ||||||
| 125<\/td>\n | 5.2.1.5 Life Limiting Factors 5.2.1.6 Thermal management <\/td>\n<\/tr>\n | ||||||
| 126<\/td>\n | 5.2.1.7 Thermo-mechanical matching 5.2.1.8 Other aspects 5.2.1.9 Long-term stability 5.2.1.10 Reparability <\/td>\n<\/tr>\n | ||||||
| 127<\/td>\n | 5.2.1.11 References of potted insulations 5.2.1.12 Costs 5.2.1.13 Recommendation for use 5.2.2 Solid insulation: others 5.2.2.1 General <\/td>\n<\/tr>\n | ||||||
| 129<\/td>\n | 5.2.3 Gaseous insulation 5.2.3.1 General <\/td>\n<\/tr>\n | ||||||
| 131<\/td>\n | 5.2.3.2 Nitrogen (N2) 5.2.3.3 Sulphur Hexafluoride (SF6) <\/td>\n<\/tr>\n | ||||||
| 132<\/td>\n | 5.2.3.4 Construction elements 5.2.3.5 Long-term stability 5.2.3.6 Reparability 5.2.3.7 Mass\/Size <\/td>\n<\/tr>\n | ||||||
| 133<\/td>\n | 5.2.3.8 References of Gaseous Insulations 5.2.3.9 Costs 5.2.3.10 Recommendation for use <\/td>\n<\/tr>\n | ||||||
| 134<\/td>\n | 5.2.4 Liquid insulation (Oil) 5.2.4.1 General 5.2.4.2 Long-term stability 5.2.4.3 Reparability <\/td>\n<\/tr>\n | ||||||
| 135<\/td>\n | 5.2.4.4 References of Liquid Insulations 5.2.4.5 Costs 5.2.4.6 Recommendation for use 5.2.5 Space vacuum insulation 5.2.5.1 General <\/td>\n<\/tr>\n | ||||||
| 136<\/td>\n | 5.2.5.2 Insulator surfaces <\/td>\n<\/tr>\n | ||||||
| 140<\/td>\n | 5.2.5.3 Conditioning effects 5.2.5.4 Cleaning and preparation <\/td>\n<\/tr>\n | ||||||
| 141<\/td>\n | 5.2.5.5 Leakage currents and triple-junction effect 5.2.5.6 Control of pressure 5.2.5.7 On ground testing 5.2.5.8 Long-term stability <\/td>\n<\/tr>\n | ||||||
| 142<\/td>\n | 5.2.5.9 Reparability 5.2.5.10 References of vacuum insulations 5.2.5.11 Costs 5.2.5.12 Recommendation for use <\/td>\n<\/tr>\n | ||||||
| 143<\/td>\n | 5.3.1 Transformers and inductors <\/td>\n<\/tr>\n | ||||||
| 146<\/td>\n | 5.3.2 Capacitors <\/td>\n<\/tr>\n | ||||||
| 149<\/td>\n | 5.3.3 Resistors <\/td>\n<\/tr>\n | ||||||
| 151<\/td>\n | 5.3.4 Semiconductors 5.3.5 Wires and cables <\/td>\n<\/tr>\n | ||||||
| 156<\/td>\n | 5.3.6 Connectors <\/td>\n<\/tr>\n | ||||||
| 157<\/td>\n | 5.3.7 Interconnections <\/td>\n<\/tr>\n | ||||||
| 159<\/td>\n | 5.3.8 Insulators and spacers <\/td>\n<\/tr>\n | ||||||
| 160<\/td>\n | 5.3.9 Feedthroughs <\/td>\n<\/tr>\n | ||||||
| 161<\/td>\n | 5.3.10 Printed circuit boards <\/td>\n<\/tr>\n | ||||||
| 163<\/td>\n | 5.3.11 Other components <\/td>\n<\/tr>\n | ||||||
| 164<\/td>\n | 6 High voltage testing 6.1.1 Insulation Resistance Test (INR) 6.1.1.1 Applicability 6.1.1.2 Objectives 6.1.1.3 Rationale 6.1.1.4 Method 6.1.1.5 Acceptance Criteria <\/td>\n<\/tr>\n | ||||||
| 165<\/td>\n | 6.1.2 Bulk Resistance Measurement (BRM) 6.1.2.1 Applicability 6.1.2.2 Objectives 6.1.2.3 Rationale 6.1.2.4 Method 6.1.2.5 Acceptance Criteria <\/td>\n<\/tr>\n | ||||||
| 166<\/td>\n | 6.1.3 Surface Resistance Measurement (SRM) 6.1.3.1 Applicability 6.1.3.2 Objectives 6.1.3.3 Rationale 6.1.3.4 Method 6.1.3.5 Acceptance Criteria <\/td>\n<\/tr>\n | ||||||
| 167<\/td>\n | 6.1.4 Polarisation and Depolarisation Current Measurement (PDC) 6.1.4.1 Applicability 6.1.4.2 Objectives 6.1.4.3 Rationale 6.1.4.4 Method 6.1.4.5 Acceptance Criteria <\/td>\n<\/tr>\n | ||||||
| 168<\/td>\n | 6.1.5 Dielectric Loss Factor Test (DLF) 6.1.5.1 Applicability 6.1.5.2 Objectives 6.1.5.3 Rationale 6.1.5.4 Method 6.1.5.5 Acceptance Criteria <\/td>\n<\/tr>\n | ||||||
| 169<\/td>\n | 6.1.6 Partial Discharge Test (PDT) 6.1.6.1 Objective 6.1.6.2 Rationale 6.1.6.3 Method and Acceptance Criteria <\/td>\n<\/tr>\n | ||||||
| 170<\/td>\n | 6.1.6.4 Aspects of implementation and test environment <\/td>\n<\/tr>\n | ||||||
| 175<\/td>\n | 6.1.7 Dielectric Withstanding Voltage Test (DWV) 6.1.7.1 Objective 6.1.7.2 Rationale 6.1.7.3 Method <\/td>\n<\/tr>\n | ||||||
| 176<\/td>\n | 6.1.7.4 Acceptance Criteria <\/td>\n<\/tr>\n | ||||||
| 177<\/td>\n | 6.1.8 Triple Junction Test (TRJ) 6.1.8.1 Applicability 6.1.8.2 Objective 6.1.8.3 Rationale 6.1.8.4 Method <\/td>\n<\/tr>\n | ||||||
| 178<\/td>\n | 6.1.8.5 Acceptance Criteria <\/td>\n<\/tr>\n | ||||||
| 179<\/td>\n | 6.1.9 Critical pressure testing\/Corona testing (CPT) 6.1.9.1 Objective 6.1.9.2 Rationale 6.1.9.3 Method <\/td>\n<\/tr>\n | ||||||
| 181<\/td>\n | 6.1.9.4 Acceptance Criteria <\/td>\n<\/tr>\n | ||||||
| 182<\/td>\n | 6.1.10 Life testing (LIT) 6.1.10.1 Objective 6.1.10.2 Rationale 6.1.10.3 Method 6.1.10.4 Acceptance Criteria <\/td>\n<\/tr>\n | ||||||
| 183<\/td>\n | 6.1.11 Accelerated life testing (ALT) 6.1.11.1 Objective 6.1.11.2 Rationale 6.1.11.3 Method 6.1.11.4 Acceptance Criteria <\/td>\n<\/tr>\n | ||||||
| 184<\/td>\n | 6.1.12 Burn-in testing (BIT) 6.1.12.1 Objective 6.1.12.2 Rationale 6.1.12.3 Method 6.1.12.4 Acceptance Criteria <\/td>\n<\/tr>\n | ||||||
| 185<\/td>\n | 6.2.1 Breakdown Voltage Test (BVT) 6.2.1.1 Objective 6.2.1.2 Rationale 6.2.1.3 Method <\/td>\n<\/tr>\n | ||||||
| 186<\/td>\n | 6.2.1.4 Acceptance Criteria 6.2.2 Lifetime evaluation testing (LET) 6.2.2.1 Objective 6.2.2.2 Rationale 6.2.2.3 Method 6.2.2.4 Acceptance Criteria <\/td>\n<\/tr>\n | ||||||
| 191<\/td>\n | 7 High voltage product aspects 7.1.1 Best practice for materials and processes selection <\/td>\n<\/tr>\n | ||||||
| 193<\/td>\n | 7.1.2 Best practice for design <\/td>\n<\/tr>\n | ||||||
| 195<\/td>\n | 7.1.3 Best practice for qualification <\/td>\n<\/tr>\n | ||||||
| 196<\/td>\n | 7.1.4 Best practice for flight acceptance <\/td>\n<\/tr>\n | ||||||
| 197<\/td>\n | 7.1.5 Best practice for verification <\/td>\n<\/tr>\n | ||||||
| 198<\/td>\n | 7.1.6 PID <\/td>\n<\/tr>\n | ||||||
| 199<\/td>\n | 7.1.7 Evaluation Plan <\/td>\n<\/tr>\n | ||||||
| 200<\/td>\n | 8 Specific problem areas 8.1.1 High voltage converters <\/td>\n<\/tr>\n | ||||||
| 202<\/td>\n | 8.1.2 Electric propulsion 8.1.2.1 Criticality of load characterization <\/td>\n<\/tr>\n | ||||||
| 204<\/td>\n | 8.1.2.2 Electromagnetic compatibility of EP <\/td>\n<\/tr>\n | ||||||
| 205<\/td>\n | 8.1.2.3 Satellite Architecture Aspects <\/td>\n<\/tr>\n | ||||||
| 206<\/td>\n | 8.1.2.4 Assembly, Integration and Test Issues of EP <\/td>\n<\/tr>\n | ||||||
| 207<\/td>\n | 8.1.3 Electron devices (tubes) 8.1.4 Scientific instruments and experiments 8.1.5 EMC aspects <\/td>\n<\/tr>\n | ||||||
| 209<\/td>\n | 9 Hazards and safety <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Space engineering. High voltage engineering and design handbook<\/b><\/p>\n |