{"id":424336,"date":"2024-10-20T06:51:15","date_gmt":"2024-10-20T06:51:15","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-iec-60286-32022-tc-2023\/"},"modified":"2024-10-26T12:52:43","modified_gmt":"2024-10-26T12:52:43","slug":"bs-en-iec-60286-32022-tc-2023","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-iec-60286-32022-tc-2023\/","title":{"rendered":"BS EN IEC 60286-3:2022 – TC 2023"},"content":{"rendered":"
This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).<\/p>\n
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1<\/td>\n | 30468449 <\/td>\n<\/tr>\n | ||||||
79<\/td>\n | A-30414097 <\/td>\n<\/tr>\n | ||||||
80<\/td>\n | undefined <\/td>\n<\/tr>\n | ||||||
85<\/td>\n | Annex ZA (normative)Normative references to international publicationswith their corresponding European publications <\/td>\n<\/tr>\n | ||||||
87<\/td>\n | English CONTENTS <\/td>\n<\/tr>\n | ||||||
91<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
93<\/td>\n | INTRODUCTION <\/td>\n<\/tr>\n | ||||||
94<\/td>\n | 1 Scope 2 Normative references 3 Terms, definitions and symbols 3.1 Terms and definitions <\/td>\n<\/tr>\n | ||||||
95<\/td>\n | Tables Table 1 \u2013 Component size codes <\/td>\n<\/tr>\n | ||||||
96<\/td>\n | 3.2 Symbols Figures Figure 1 \u2013 Sectional view of component cavity (type 1b) Table 2 \u2013 Classification to symbols concerning tape, reel and common symbols <\/td>\n<\/tr>\n | ||||||
98<\/td>\n | 4 Structure of the specification 5 Dimensional requirements for taping 5.1 Component cavity positioning requirements 5.1.1 Requirements for type 1a, type 1b, type 2a, type 2b and type 3 5.1.2 Requirements for type 4 <\/td>\n<\/tr>\n | ||||||
99<\/td>\n | 5.2 Component cavity dimension requirements (type 1a, type 1b, type 2a, type 2b and type 3) 5.3 Type 1a \u2013 Punched carrier tape, with top and bottom cover tape (tape widths: 8 mm and 12 mm) Figure 2 \u2013 8 mm and 12 mm punched carrier-tape dimensions (4 mm cavity pitch) <\/td>\n<\/tr>\n | ||||||
100<\/td>\n | Figure 3 \u2013 Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset Figure 4 \u2013 Maximum component tilt, rotation and lateral movement <\/td>\n<\/tr>\n | ||||||
101<\/td>\n | Table 3 \u2013 Constant dimensions of 8 mm and 12 mm punched carrier tape Table 4 \u2013 Variable dimensions of 8 mm and 12 mm punched carrier tape <\/td>\n<\/tr>\n | ||||||
102<\/td>\n | 5.4 Type 1b \u2013 Pressed carrier tape, with top cover tape (tape width: 8 mm) Figure 5 \u2013 Dimensions (P0 = 4 mm\/P1 = 2 mm) and (P0 = 4 mm\/P1 = 1 mm) Table 5 \u2013 Component tilt, planar rotation and lateral movement <\/td>\n<\/tr>\n | ||||||
103<\/td>\n | Figure 6 \u2013 Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset Figure 7 \u2013 Maximum component tilt, rotation and lateral movement Table 6 \u2013 Constant dimensions of 8 mm pressed carrier tape <\/td>\n<\/tr>\n | ||||||
104<\/td>\n | 5.5 Type 2a \u2013 Blister carrier tape, with single round sprocket holes and tape pitches down to 2 mm (tape widths: 8 mm, 12 mm, 16 mm and 24 mm) Figure 8 \u2013 Blister carrier tape dimensions (8 mm, 12 mm, 16 mm and 24 mm) Table 7 \u2013 Variable dimensions of 8 mm pressed carrier tape Table 8 \u2013 Component tilt, planar rotation and lateral movement <\/td>\n<\/tr>\n | ||||||
105<\/td>\n | Figure 9 \u2013 Illustration of 2 mm cavity pitch and pocket offset Figure 10 \u2013 Maximum component tilt, rotation and lateral movement Table 9 \u2013 Constant dimensions of 8 mm to 24 mm blister carrier tape <\/td>\n<\/tr>\n | ||||||
106<\/td>\n | 5.6 Type 2b \u2013 Blister carrier tape, with single round sprocket holes and with 1mm tape pitch (tape widths: 4 mm) Table 10 \u2013 Variable dimensions of 8 mm to 24 mm blister carrier tape Table 11 \u2013 Component tilt, rotation and lateral movement <\/td>\n<\/tr>\n | ||||||
107<\/td>\n | Figure 11 \u2013 Type 2b carrier tape Figure 12 \u2013 Maximum pocket offset Figure 13 \u2013 Maximum component tilt, rotation and lateral movement <\/td>\n<\/tr>\n | ||||||
108<\/td>\n | 5.7 Type 3 \u2013 Blister carrier tape, with double sprocket holes (32 mm to 200 mm) Table 12 \u2013 Constant dimensions of 4 mm carrier tape Table 13 \u2013 Variable dimensions of 4 mm carrier tape Table 14 \u2013 Component tilt, planar rotation and lateral movements <\/td>\n<\/tr>\n | ||||||
109<\/td>\n | Figure 14 \u2013 Blister carrier tape Figure 15 \u2013 Elongated sprocket hole skew Figure 16 \u2013 Maximum component tilt, rotation and lateral movement <\/td>\n<\/tr>\n | ||||||
110<\/td>\n | Table 15 \u2013 Constant dimensions of 32 mm to 200 mm blister carrier tape Table 16 \u2013 Variable dimensions of 32 mm to 200 mm blister carrier tape <\/td>\n<\/tr>\n | ||||||
111<\/td>\n | 5.8 Type 4 \u2013 Adhesive-backed punched plastic carrier tape for singled bare die and other surface mount components (8 mm, 12 mm, 16 mm and 24 mm) Figure 17 \u2013 Adhesive-backed punched carrier-tape dimensions(4 mm compartment pitch) Figure 18 \u2013 Illustration of 2 mm compartment pitch Table 17 \u2013 Component tilt, planar rotation and lateral movements <\/td>\n<\/tr>\n | ||||||
112<\/td>\n | Figure 19 \u2013 Maximum component planar rotation and lateral displacement Table 18 \u2013 Dimensions of adhesive backed punched carrier tape <\/td>\n<\/tr>\n | ||||||
113<\/td>\n | 6 Polarity and orientation requirements of components in the tape 6.1 Requirements for all types Table 19 \u2013 Variable dimensions of adhesive-backed punched carrier tape Table 20 \u2013 Component planar rotation and lateral displacement <\/td>\n<\/tr>\n | ||||||
114<\/td>\n | 6.2 Specific requirements for type 1a 6.3 Specific requirements for type 4 7 Carrier tape requirements 7.1 Taping materials 7.2 Minimum bending radius (for all types) Figure 20 \u2013 Example of polarity and orientation <\/td>\n<\/tr>\n | ||||||
115<\/td>\n | 7.3 Camber Figure 21 \u2013 Bending radius Table 21 \u2013 Minimum bending radius <\/td>\n<\/tr>\n | ||||||
116<\/td>\n | 8 Cover tape requirements (for type 1a, type 1b, type 2a, type 2b and type 3) Figure 22 \u2013 Measuring method and camber <\/td>\n<\/tr>\n | ||||||
117<\/td>\n | Figure 23 \u2013 Dot seals for thin components (as exceptions) Table 22 \u2013 Peel force <\/td>\n<\/tr>\n | ||||||
118<\/td>\n | 9 Component taping and additional tape requirements 9.1 All types 9.2 Specific requirements for type 1b 9.3 Specific tape requirements for type 2b <\/td>\n<\/tr>\n | ||||||
119<\/td>\n | 9.4 Specific requirement for type 4 9.4.1 General 9.4.2 Coordinate system Table 23 \u2013 Absolute referencing data for component target position <\/td>\n<\/tr>\n | ||||||
120<\/td>\n | 9.4.3 Component positioning and lateral displacement Figure 24 \u2013 Type 4 coordinate system <\/td>\n<\/tr>\n | ||||||
121<\/td>\n | 9.5 Specific requirements for tapes containing die products 9.5.1 General 9.5.2 Tape design for tapes containing die products 9.5.3 Cleanliness Figure 25 \u2013 Component clearance and positioning method <\/td>\n<\/tr>\n | ||||||
122<\/td>\n | 9.5.4 Die lateral movement (type 1a, type 2a and type 2b) 10 Reel requirements 10.1 Dimensions 10.1.1 General 10.1.2 Reel dimensions Figure 26 \u2013 Reel <\/td>\n<\/tr>\n | ||||||
123<\/td>\n | 10.1.3 Reel hole dimensions Table 24 \u2013 Reel dimensions <\/td>\n<\/tr>\n | ||||||
124<\/td>\n | 10.1.4 Drive hole dimensions (optional) Figure 27 \u2013 Reel hole presentation Table 25 \u2013 Reel hole dimensions <\/td>\n<\/tr>\n | ||||||
125<\/td>\n | 10.2 Marking Figure 28 \u2013 Drive hole layout Table 26 \u2013 Drive hole dimensions <\/td>\n<\/tr>\n | ||||||
126<\/td>\n | 11 Tape reeling requirements 11.1 All types 11.2 Specific requirements for type 1a 11.3 Specific requirements for type 4 11.4 Leader and trailer tape 11.4.1 General Figure 29 \u2013 Tape reeling and label area on the reel <\/td>\n<\/tr>\n | ||||||
127<\/td>\n | 11.4.2 Leader 11.4.3 Trailer 11.5 Recycling 11.6 Missing components Figure 30 \u2013 Leader and trailer <\/td>\n<\/tr>\n | ||||||
128<\/td>\n | Annex A (normative) Recommended measuring methods for type 1b A.1 Measurement method for carrier tape thickness (T and T3) A.2 Measurement method for cavity (A0 and B0) Figure A.1 \u2013 Carrier tape thickness measurement points <\/td>\n<\/tr>\n | ||||||
129<\/td>\n | A.3 Measurement method for cavity depth (dimension K0) Figure A.2 \u2013 Cavity cross-section Figure A.3 \u2013 Cavity depth dimension <\/td>\n<\/tr>\n | ||||||
130<\/td>\n | Annex B (informative) Measuring methods of electrostatic potential and charge decay performance while cover tape is peeled off from carrier tape containing surface mount devices B.1 General <\/td>\n<\/tr>\n | ||||||
131<\/td>\n | B.2 Method for measuring electrostatic potential and charge decay performance B.2.1 General Figure B.1 \u2013 Configuration of measurement method usingelectrostatic potential measuring system <\/td>\n<\/tr>\n | ||||||
132<\/td>\n | Figure B.2 \u2013 Diagram of measure electrostatic potential when peeling cover tape Figure B.3 \u2013 Configuration of electrostatic charge decay measurement method <\/td>\n<\/tr>\n | ||||||
133<\/td>\n | B.2.2 Measurement instrument and device Figure B.4 \u2013 Diagram of the measurement of electrostatic charge decay performance <\/td>\n<\/tr>\n | ||||||
135<\/td>\n | B.2.3 Sample (test specimen) B.2.4 Pre-treatment conditions and measurement environment conditions Figure B.5 \u2013 Dimensions of the sample <\/td>\n<\/tr>\n | ||||||
136<\/td>\n | B.2.5 Measurement conditions B.2.6 Method for measuring electrostatic potential Table B.1 \u2013 Conditions of the environment in which the samples are kept and the conditions of the measurement test environment before measurement <\/td>\n<\/tr>\n | ||||||
137<\/td>\n | B.2.7 Method for measuring the electrostatic charge decay performance <\/td>\n<\/tr>\n | ||||||
138<\/td>\n | B.3 Items to be described in the test report and items to be specified in the related standards B.3.1 Items to be described in the test report <\/td>\n<\/tr>\n | ||||||
139<\/td>\n | B.3.2 Items specified in related standards <\/td>\n<\/tr>\n | ||||||
140<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Tracked Changes. Packaging of components for automatic handling – Packaging of surface mount components on continuous tapes<\/b><\/p>\n |