BS 5131-1.8:1981
$86.31
Methods of test for footwear and footwear materials. Adhesives – Rate of bond strength development in shear of hot melt adhesives for lasting
| Published By | Publication Date | Number of Pages |
| BSI | 1981 | 10 |
This Section describes the preparation of shear test joints with hot melt adhesives by a method which simulates the bonding of the shoe upper to the insole in the lasting operation. The method determines, for a chosen application temperature, the resistance to shear of the joint after various wiper plate dwell times. This enables the setting characteristics of adhesives to be compared in terms of the rate of bond strength development and/or wiper plate dwell time.
The method is applicable to combinations of materials where at least one of the adherends is flexible (normally shoe insole and upper materials) and to hot melt adhesives in free forms, e.g. granules or rods.
The absolute performance of an adhesive in a lasting machine can only be determined in factory trials.
A method of assessing and comparing the characteristics of hot melt adhesives and the conditions of their application, particularly in lasting operations.
