BS EN 60749-20:2009 2010

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Semiconductor devices. Mechanical and climatic test methods – Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

Published By	Publication Date	Number of Pages
BSI	2010	32

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Categories: 31.080.01 - Semiconductor devices in general, BSI

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Description

IEC 60749-20:2008 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. This second edition cancels and replaces the first edition published in 2002 and constitutes a technical revision. The main changes are as follows: – to reconcile certain classifications of IEC 60749-20 and those of IPC/JEDEC J-STD-020C; – reference IEC 60749-35 instead of Annex A of IEC 60749-20, Edition 1; – update for lead-free solder; – correct certain errors in the original Edition 1.

Additional information

Status	Withdrawn
Title	Semiconductor devices. Mechanical and climatic test methods – Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
Replaces	BS EN 60749-20:2003
Publisher	BSI
Committee	EPL/47
Pages	32
Publication Date	2010-01-31
Withdrawn Date	2020-10-14
Replaced By	BS EN IEC 60749-20:2020
ISBN	978 0 580 59478 6
Standard Number	BS EN 60749-20:2009
Identical National Standard Of	EN 60749-20:2009, IEC 62298-3:2005, EN 62298-3:2005, IEC 60749-20:2008
Descriptors	Plastics, Climate, Thermal testing, Encapsulated, Surface mounting devices, Damp-heat tests, Environmental testing, Electronic equipment and components, Semiconductor devices, Integrated circuits, Soldering, Solderability testing, Mechanical testing
ICS Codes	31.080.01 - Semiconductor devices in general

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BS EN 60749-20:2009 2010

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