BS EN 61190-1-2:2007

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Attachment materials for electronic assembly – Requirements for soldering pastes for high-quality interconnects in electronics assembly

Published By	Publication Date	Number of Pages
BSI	2007	22

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Description

IEC 61190-1-2:2007 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material’s performance in the manufacturing process. The main changes with regard to the first edition concern a definition of lead-free solder alloy and an explanation of solder ball test standards.

Additional information

Status	Withdrawn
Title	Attachment materials for electronic assembly – Requirements for soldering pastes for high-quality interconnects in electronics assembly
Replaces	BS EN 61190-1-2:2002
Publisher	BSI
Committee	EPL/501
Pages	22
Publication Date	2007-07-31
Withdrawn Date	2014-06-30
Replaced By	BS EN 61190-1-2:2014
ISBN	978 0 580 55336 3
Standard Number	BS EN 61190-1-2:2007
Identical National Standard Of	EN 61190-1-2:2007, IEC 61190-1-2:2007, EN 60191-4:1999/A1:2002
Descriptors	Quality control, Bonding, Quality assurance, Solders, Electronic equipment and components, Electrical connections, Pastes, Soldering, Electronic engineering, Classification systems, Soldered connectors
ICS Codes	31.190 - Electronic component assemblies

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BS EN 61190-1-2:2007

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