BS EN 62137-1-4:2009

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Surface mounting technology. Environmental and endurance test methods for surface mount solder joint – Cyclic bending test

Published By	Publication Date	Number of Pages
BSI	2009	18

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Description

The test method described in IEC 62137-1-4:2009 applies to surface mount components with a thin and wide basal plane, such as QFP and BGA. This test method evaluates the endurance of the solder joints between component leads and lands on a substrate by cyclic bending of substrate. This test also evaluates the effects of repeated mechanical stress, such as key pushing in cell phones, the strength of the solder joint between component terminals and lands on a substrate.

Additional information

Status	Definitive
Pages	18
Publication Date	2009-03-31
ISBN	978 0 580 59252 2
Standard Number	BS EN 62137-1-4:2009
Title	Surface mounting technology. Environmental and endurance test methods for surface mount solder joint – Cyclic bending test
Identical National Standard Of	EN 62137-1-4:2009, IEC 62137-1-4:2009
Descriptors	Bend testing, Mechanical testing, Surface mounting, Surface mounting devices, Soldered joints, Cyclic, Integrated circuits, Endurance testing, Environmental testing, Soldering, Printed-circuit boards
Publisher	BSI
Committee	EPL/501
ICS Codes	31.190 - Electronic component assemblies

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BS EN 62137-1-4:2009

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