BS EN ISO 9453:2020

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Soft solder alloys. Chemical compositions and forms

Published By	Publication Date	Number of Pages
BSI	2020	24

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Categories: 25.160.50 - Brazing and soldering, BSI

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Description

This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.

An indication of the forms generally available is also included.

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PDF Pages	PDF Title
2	undefined
7	Foreword
8	Introduction
10	1 Scope 2 Normative references 3 Terms and definitions 4 Chemical composition 5 Forms of delivery 5.1 General
11	5.2 Unit of product 6 Sampling and analysis 7 Marking, labelling and packaging
19	Annex A (informative) Comparison between alloy numbers in this document and short names and chemical compositions according to IEC 61190-1-3
22	Bibliography

Additional information

Status	Definitive
Pages	24
Publication Date	2020-10-13
ISBN	978 0 539 05475 0
Standard Number	BS EN ISO 9453:2020
Title	Soft solder alloys. Chemical compositions and forms
Identical National Standard Of	ENISO 9453, ISO 9453
Replaces	BS EN ISO 9453:2014
Descriptors	Lead alloys, Indium-containing alloys, Silver-containing alloys, Bismuth-containing alloys, Copper-containing alloys, Chemical composition, Marking, Tin alloys, Lead-containing alloys, Cadmium-containing alloys, Solders, Antimony-containing alloys, Shape, Joining materials
Publisher	BSI
Committee	EPL/501
ICS Codes	25.160.50 - Brazing and soldering

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BS EN ISO 9453:2020

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