BSI 19/30394485 DC:2019 Edition
$13.70
BS EN IEC 60749-20. Semiconductor devices. Mechanical and climatic test methods – Part 20. Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
| Published By | Publication Date | Number of Pages |
| BSI | 2019 | 30 |
| Status | Definitive |
|---|---|
| Pages | 30 |
| Publication Date | 2019-05-29 |
| Standard Number | 19/30394485 DC |
| Title | BS EN IEC 60749-20. Semiconductor devices. Mechanical and climatic test methods – Part 20. Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| Identical National Standard Of | 47/2563/CDV |
| Descriptors | Plastics, Climate, Thermal testing, Encapsulated, Surface mounting devices, Damp-heat tests, Environmental testing, Electronic equipment and components, Semiconductor devices, Integrated circuits, Soldering, Solderability testing, Mechanical testing |
| Publisher | BSI |
| Committee | EPL/47 |
| ICS Codes | 31.080.01 - Semiconductor devices in general |
