šŸ”„šŸ”„ Donā€™t Miss Out on Our End of Autumn Sale. If you have any questions, feel free to click the bottom right corner to contact our customer service..

Concat us[email protected]
Shopping Cart

No products in the cart.

šŸ”
BS EN 50310:2016

BS EN 50310:2016

$198.66

Telecommunications bonding networks for buildings and other structures

Published By Publication Date Number of Pages
BSI 2016 52
PDF Format Searchable Printable Preview Now
Guaranteed Safe Checkout
Categories: ,

If you have any questions, feel free to reach out to our online customer service team by clicking on the bottom right corner. Weā€™re here to assist you 24/7.
Email:[email protected]

This European Standard specifies requirements and provides recommendations for the design and installation of connections (bonds) between various electrically conductive elements in buildings and other structures, during their construction or refurbishment, in which information technology (IT) and, more generally, telecommunications equipment is intended to be installed in order to:

  1. minimize the risk to the correct function of that equipment and interconnecting cabling from electrical hazards;

  2. provide the telecommunications installation with a reliable signal reference ā€” which may improve immunity from electromagnetic interference (EMI).

The requirements of this European Standard are applicable to the buildings and other structures within premises addressed by EN 50174ā€‘2 (e.g. residential, office, industrial and data centres) but information given in this European Standard may be of assistance for other types of buildings and structures.

NOTE

Telecommunications centres (operator buildings) are addressed by ETSI/EN 300 253 .

This European Standard does not apply to power supply distribution of voltages over AC 1 000 V.

Electromagnetic compatibility (EMC) requirements and safety requirements for power supply installation are outside the scope of this European Standard and are covered by other standards and regulations. However, information given in this European Standard may be of assistance in meeting the requirements of these standards and regulations.

PDF Catalog

PDF Pages PDF Title
6 European foreword
8 Introduction
9 Figure 1 ā€“ Schematic relationship between EN 50310 and other relevant standards
10 Table 1 ā€“ Contextual relationship between EN 50310 and other relevant standards
11 1 Scope
2 Normative references
12 3 Terms, definitions and abbreviations
3.1 Terms and definitions
14 3.2 Abbreviations
15 4 Conformance
5 Overview of bonding networks
16 Figure 2 ā€“ Schematic of telecommunications equipment distribution and associated bonding connections
17 6 Selection of the telecommunications bonding network approach
6.1 Assessment of the impact of the telecommunications bonding network on the interconnection of telecommunications equipment
Table 2 ā€“ Sensitivity of cabling media to bonding network performance
18 Table 3 ā€“ Telecommunications bonding network requirements
6.2 Telecommunications bonding networks
19 6.3 Telecommunications bonding network performance
6.3.1 General
6.3.1.1 Protective bonding networks
6.3.1.2 Dedicated telecommunications bonding networks
6.3.2 Requirements
6.3.2.1 General requirements
20 6.3.2.2 Protective bonding networks
Table 4 ā€“ DC resistance requirements for protective bonding networks
6.3.2.3 Dedicated bonding networks
Table 5 ā€“ DC resistance requirements for dedicated telecommunications bonding networks
6.3.3 DC resistance measurements
6.3.3.1 General
21 6.3.3.2 Dedicated bonding networks
7 Common features
7.1 General
7.2 Protective bonding networks
7.2.1 Protective bonding network conductors (PBNCs)
7.2.2 Main earthing terminal (MET)
7.3 Telecommunications entrance facility (TEF)
22 7.4 Telecommunications bonding network components
7.4.1 Telecommunications bonding network conductors
7.4.1.1 Materials
7.4.1.2 Installation
7.4.2 Telecommunications bonding network connections
23 7.5 Cabinets, frames and racks
7.5.1 External connections to a bonding network
7.5.1.1 Requirements
24 Figure 3 ā€“ Example of three methods of equipment and rack bonding
7.5.1.2 Recommendations
7.5.2 Rack bonding conductors
7.5.2.1 Rack bonding conductors for d.c. resistance control
7.5.2.2 Rack bonding conductors (RBC) for impedance control
7.5.2.2.1 Requirements
7.5.2.2.2 Recommendations
25 7.5.3 Internal connections
7.5.3.1 Requirements
Figure 4 ā€“ Example of a bond connection from a cabinet to the cabinet door
7.5.3.2 Structural bonding within cabinets, frames and racks
26 7.6 Miscellaneous bonding connections
7.6.1 General
7.6.2 Bonding conductors for d.c. resistance control
7.6.3 Bonding conductors for impedance control
7.6.3.1 Requirements
7.6.3.2 Recommendations
Figure 5 ā€“ Example of bonding straps
27 7.7 Documentation
8 Dedicated telecommunications bonding network
8.1 General
28 Figure 6 ā€“ Illustrative example of a large building
Figure 7 ā€“ Illustrative example of a smaller building
8.2 Components
8.2.1 Primary bonding busbar (PBB)
29 Figure 8 ā€“ Schematic of PBB
8.2.2 Secondary bonding busbar (SBB)
Figure 9 ā€“ Schematic of SBB
8.2.3 Bonding conductors for d.c. resistance control
8.2.3.1 Telecommunications bonding conductor (TBC)
30 8.2.3.2 Telecommunications bonding backbone (TBB)
8.2.3.2.1 Requirements
8.2.3.2.2 Recommendations
31 Table 6 ā€“ TBB conductor sizing
8.2.3.3 Backbone bonding conductor (BBC)
8.2.4 Bonding conductors for impedance control
8.2.4.1 Telecommunications bonding backbone (TBB)
8.2.4.1.1 Requirements
8.2.4.1.2 Recommendations
8.2.4.2 Backbone bonding conductor (BBC)
8.2.4.2.1 Requirements
32 8.2.4.2.2 Recommendations
8.3 Implementation
8.3.1 Primary bonding busbar (PBB)
8.3.1.1 General
8.3.1.2 Bonding to the PBB
33 8.3.2 Secondary bonding busbar (SBB)
8.3.2.1 General
8.3.2.2 Bonding to the secondary bonding busbar
34 8.3.3 Telecommunications bonding conductor (TBC)
8.3.4 Telecommunications bonding backbone (TBB)
8.3.5 Backbone bonding conductor (BBC)
8.3.6 Bonds to continuous conductive pathway systems
8.3.7 Bonds to structural metal
35 9 Local telecommunications bonding networks in conjunction with protective bonding networks
9.1 Bonding for local distribution
9.1.1 Star protective bonding networks
Figure 10 ā€“ Star protective bonding and supplementary telecommunications bonding
Figure 11 ā€“ Example of high common impedance and large loop
36 Figure 12 ā€“ Example of low common impedance and small loop
9.1.2 Ring protective bonding networks
Figure 13 ā€“ Ring protective bonding and supplementary telecommunications bonding
37 9.2 Telecommunications bonding conductors
9.2.1 Bonding conductors for d.c. resistance control
9.2.1.1 Requirements
9.2.1.2 Recommendations
Figure 14 ā€“ MESH-BN example
38 9.2.2 Bonding conductors for impedance control
9.2.2.1 Requirements
9.2.2.2 Recommendations
9.3 Bonding for areas of telecommunications equipment concentration
10 Local telecommunications bonding networks in conjunction with dedicated telecommunications bonding networks
10.1 Bonding for areas of telecommunications equipment concentration
10.1.1 Requirements
10.1.2 Recommendations
10.1.3 Cabinets, frames and racks
39 10.2 Telecommunications equipment bonding conductors (TEBC)
10.2.1 TEBC for d.c. resistance control
10.2.2 TEBC for impedance control
10.2.2.1 Requirements
10.2.2.2 Recommendations
10.2.3 Implementation
Figure 15 ā€“ Example TEBC to rack bonding conductor connection
40 11 Mesh bonded networks
11.1 General
11.2 Mesh bonding alternatives
11.2.1 Local mesh bonding (MESH-IBN) networks
11.2.1.1 General
41 Figure 16 ā€“ Local mesh bonding network
Figure 17 ā€“ A MESH-IBN having a single point of connection (SPC)
11.2.1.2 Requirements
42 11.2.1.3 Recommendations
11.2.2 MESH-BN
11.2.2.1 General
Figure 18 ā€“ A MESH-BN with equipment cabinets, frames, racks and CBN bonded together
11.2.2.2 Requirements
43 11.3 Bonding conductors of a mesh bonding network
11.3.1 Requirements
11.3.2 Recommendations
11.4 Bonding conductors to the mesh bonding network
44 11.5 Supplementary bonding grid (SBG)
11.6 System reference potential plane (SRPP)
11.6.1 General
45 11.6.2 Access floors
11.6.2.1 Requirements
Figure 19 ā€“ Example of access floor
11.6.2.2 Recommendations
46 11.6.3 Transient suppression plate (TSP)
Figure 20 ā€“ Example of installation details for an under floor transient suppression plate
47 Annex A (normative) Maintenance of telecommunications bonding network performance
A.1 General
A.2 Periodic activity
A.2.1 Schedule
A.2.2 Implementation
A.2.2.1 Protective bonding network
A.2.2.2 Dedicated bonding network
A.2.2.3 Assessment of results
48 A.3 Causes of performance deterioration
A.3.1 Galvanic corrosion
A.3.2 Requirements
49 Bibliography

Related products

BS EN 50310:2016
$198.66