BS EN 60068-2-69:2017:2018 Edition
$198.66
Environmental testing – Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
| Published By | Publication Date | Number of Pages |
| BSI | 2018 | 58 |
This part of IEC 60068 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations. Data obtained by these methods are not intended to be used as absolute quantitative data for pass-fail purposes.
The procedures describe the solder bath wetting balance method and the solder globule wetting balance method. They are applicable to components and printed boards with metallic terminations and metallized solder pads.
This document provides the measurement procedures for solder alloys both with and without lead (Pb).
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 2 | undefined |
| 7 | English CONTENTS |
| 10 | FOREWORD |
| 12 | 1 Scope 2 Normative references 3 Terms and definitions |
| 13 | 4 General description of the method 4.1 General 4.2 Components 4.3 Printed boards 4.4 Measurement 5 Description of the test apparatus |
| 14 | Figures Figure 1 – Arrangement for the test apparatus (solder bath wetting balance method) Figure 2 – Arrangement for the test apparatus (solder globule wetting balance method) |
| 15 | 6 Preparation of specimens 6.1 Cleaning 6.2 Preconditioning Tables Table 1 – Preconditioning |
| 16 | 7 Materials 7.1 Solder 7.1.1 General 7.1.2 Solder alloy containing lead 7.1.3 Lead-free solder alloy 7.1.4 Solder contamination control |
| 17 | 7.1.5 Solder mass for solder globule wetting balance method Table 2 – Maximum limits of solder bath contaminants Table 3 – Globule and pellet sizes |
| 18 | 7.2 Flux 7.2.1 Rosin based flux 7.2.2 Flux maintenance 7.2.3 Test flux selection criteria 8 Procedure 8.1 Test temperature 8.1.1 Solder alloy containing lead 8.1.2 Lead-free solder alloy 8.2 Test procedure 8.2.1 Applicable test procedure Table 4 – Rosin based flux compositions |
| 19 | 8.2.2 Solder bath wetting balance procedure |
| 20 | Table 5 – Recommended solder bath wetting balance test conditions |
| 21 | Figure 3 – Immersion conditions for solder bath method |
| 22 | 8.2.3 Solder globule wetting balance procedure Table 6 – Time sequence of the test (solder bath) |
| 23 | Table 7 – Recommended solder globule wetting balance test conditions |
| 24 | Figure 4 – Immersion conditions for solder globule method |
| 25 | 8.2.4 Procedure for testing printed board specimens Figure 5 – Suggested wetting balance test specimens and soldering immersion Table 8 – Time sequence of the test (solder globule) |
| 26 | 9 Presentation of results 9.1 Form of force versus time trace Figure 6 – Printed board immersion |
| 27 | 9.2 Test requirements Figure 7 – Typical wetting balance trace |
| 28 | 10 Information to be given in the relevant specification |
| 29 | Annex A (normative)Equipment specification A.1 Characteristics of the apparatus A.2 Solder bath |
| 30 | A.3 Globule support blocks |
| 31 | Annex B (informative)Use of the wetting balance for SMD solderability testing B.1 Definition of the measure of solderability B.2 Gauge R&R – Test protocol for wetting balance gauge repeatability and reproducibility using copper foil coupons B.2.1 Test coupon |
| 32 | B.2.2 Test parameters B.2.3 Known good coupon |
| 33 | B.3 Solder globule mass and pin size B.4 Specimen orientation and immersion depth B.4.1 General |
| 34 | B.4.2 Resistors and capacitors B.4.3 Small-leaded components B.4.4 Multi-leaded devices |
| 35 | B.5 Test flux B.6 Test temperature B.6.1 Solder alloy containing lead Table B.1 – Carboxylic acid based flux (water solution) Table B.2 – Carboxylic acid based flux (alcohol solution) |
| 36 | B.6.2 Solder alloy without lead B.7 Characteristics of the test apparatus B.7.1 Recording device |
| 37 | B.7.2 Balance system B.7.3 Lifting mechanism and controls |
| 40 | Figure B.1 – Understanding wetting curves Figure B.2 – Typical wetting curve |
| 41 | Figure B.3 – Representative force-time curves |
| 42 | B.7.4 Parameters to be measured from the force-time trace B.7.5 Reference wetting force |
| 43 | B.7.6 Equipment location B.7.7 Globule pins B.7.8 Globule modules B.8 Test flux – IPC-J-STD-002/J-STD-003 activated solderability test flux rationale committee letter B.8.1 General |
| 44 | B.8.2 Proactive solderability testing approach to the implementation of non-tin finishes B.8.3 Reduced solderability test variability B.8.4 Standardization of solderability test flux composition on a global scale |
| 45 | Annex C (normative)Test methods for SMD components sizes 0603M (0201) or smaller C.1 General C.2 General description of the test method C.3 Preconditioning C.3.1 Preparation of the specimens C.3.2 Ageing C.4 Materials C.4.1 Solder |
| 46 | C.4.2 Flux C.5 Method 1 C.5.1 Description of the test apparatus C.5.2 Procedures Figure C.1 – Cross-section of aluminium body |
| 47 | Figure C.2 – Dipping position and relative position |
| 48 | Table C.1 – Time sequence of the test procedure |
| 49 | C.5.3 Presentation of results Figure C.3 – Time and test sequence |
| 50 | C.5.4 Information to be given in the relevant specification Figure C.4 – Typical wetting balance trace |
| 51 | C.6 Method 2 C.6.1 Test apparatus C.6.2 Observation equipment C.6.3 Test method 2 |
| 52 | C.6.4 Presentation of results |
| 53 | Annex D (informative)Evaluation criteria – Guidance D.1 General considerations D.2 Evaluation criteria for components Table D.1 – Wetting balance parameter and suggested evaluation criteria |
| 54 | D.3 Evaluation criteria for printed boards Figure D.1 – Set A wetting curve Figure D.2 – Set B wetting curve Table D.2 – Printed board test parameter and suggested criteria |
| 55 | Annex E (informative)Method of calculating the maximum theoretical force and integrated value of the area of the wetting curve for leaded non-SMD E.1 Method of calculating the maximum theoretical force E.2 Method of calculating the integrated value of the area of the wetting curve |
| 57 | Bibliography |
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