BS EN 60749-34:2004

$86.31

Semiconductor devices. Mechanical and climatic test methods – Power cycling

Published By	Publication Date	Number of Pages
BSI	2004	12

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Categories: 31.080.01 - Semiconductor devices in general, BSI

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Description

Used to determine the resistance of a semiconductor device to thermal and mechanical stresses due to cycling the power dissipation of the internal semiconductor die and internal connectors. This happens when low-voltage operating biases for forward conduction (load currents) are periodically applied and removed causing rapid changes of temperature. The power cycling test is complementary to high temperature operating life.

Additional information

Status	Withdrawn
Title	Semiconductor devices. Mechanical and climatic test methods – Power cycling
Publisher	BSI
Committee	EPL/47
Pages	12
Publication Date	2004-06-22
Withdrawn Date	2011-02-28
Replaced By	BS EN 60749-34:2010
ISBN	0 580 43974 7
Standard Number	BS EN 60749-34:2004
Identical National Standard Of	IEC 60749-34:2004, EN 60749-34:2004
Descriptors	Electrical testing, Mechanical testing, Low voltage, Environmental testing, Integrated circuits, Power losses, Climate, Stress analysis, Semiconductor devices, Electronic equipment and components, Thermal stress, Destructive testing, Stress
ICS Codes	31.080.01 - Semiconductor devices in general

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BS EN 60749-34:2004

$86.31


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