{"id":234281,"date":"2024-10-19T15:16:46","date_gmt":"2024-10-19T15:16:46","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bsi-20-30409196-dc\/"},"modified":"2024-10-25T09:49:16","modified_gmt":"2024-10-25T09:49:16","slug":"bsi-20-30409196-dc","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bsi-20-30409196-dc\/","title":{"rendered":"BSI 20\/30409196 DC"},"content":{"rendered":"
PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
---|---|---|---|---|---|---|---|
4<\/td>\n | CONTENTS <\/td>\n<\/tr>\n | ||||||
5<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
7<\/td>\n | PASSIVE RF AND MICROWAVE DEVICES, INTERMODULATION LEVEL MEASUREMENT 1 Scope 2 Normative references 3 Abbreviations 4 Characteristics of intermodulation products <\/td>\n<\/tr>\n | ||||||
8<\/td>\n | 5 Principle of test procedure 6 Test set-up 6.1 General 6.2 Test equipment 6.2.1 General <\/td>\n<\/tr>\n | ||||||
9<\/td>\n | 6.2.2 Set-up 1 <\/td>\n<\/tr>\n | ||||||
10<\/td>\n | 6.2.3 Set-up 2 7 Preparation of DUT and test equipment 7.1 General 7.2 Guidelines for minimizing generation of passive intermodulation <\/td>\n<\/tr>\n | ||||||
11<\/td>\n | Table 1 \u2013 Guide for the design, selection of materials and handling of components that may be susceptive to PIM generation <\/td>\n<\/tr>\n | ||||||
12<\/td>\n | Table 2 \u2013 Test set-up conditions 9.2 Example of results <\/td>\n<\/tr>\n | ||||||
13<\/td>\n | 10 Measurement error <\/td>\n<\/tr>\n | ||||||
14<\/td>\n | Figure 1 \u2013 Set-up 1; reverse IM-test set-up <\/td>\n<\/tr>\n | ||||||
15<\/td>\n | Figure 2 \u2013 Set-up 2; forward IM-test set-up <\/td>\n<\/tr>\n | ||||||
16<\/td>\n | Figure 3 \u2013 Passive intermodulation (PIM) measurement error caused by residual system error <\/td>\n<\/tr>\n | ||||||
17<\/td>\n | A.2 Configuration of low-PIM terminations A.2.1 Long cable termination Figure A.1 \u2013 Long cable termination <\/td>\n<\/tr>\n | ||||||
18<\/td>\n | Figure A.2 \u2013 Lumped termination with a linear attenuator <\/td>\n<\/tr>\n | ||||||
19<\/td>\n | 1.1.1 B.1.1 Stepped frequency sweep method 1.1.2 B.1.2 Fixed frequency method B.2 Dynamic PIM testing B.3 Heating effects <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" BS EN 62037-1. Passive RF and microwave devices, intermodulation level measurement – Part 1. General requirements and measuring methods<\/b><\/p>\n |