{"id":415656,"date":"2024-10-20T06:06:27","date_gmt":"2024-10-20T06:06:27","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bsi-pd-iec-tr-608902022\/"},"modified":"2024-10-26T11:21:13","modified_gmt":"2024-10-26T11:21:13","slug":"bsi-pd-iec-tr-608902022","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bsi-pd-iec-tr-608902022\/","title":{"rendered":"BSI PD IEC TR 60890:2022"},"content":{"rendered":"
PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
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2<\/td>\n | undefined <\/td>\n<\/tr>\n | ||||||
4<\/td>\n | CONTENTS <\/td>\n<\/tr>\n | ||||||
7<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
9<\/td>\n | INTRODUCTION <\/td>\n<\/tr>\n | ||||||
10<\/td>\n | 1 Scope 2 Normative references 3 Terms and definitions <\/td>\n<\/tr>\n | ||||||
11<\/td>\n | 4 Verification conditions 5 Calculation method 5.1 Assumptions made in this calculation <\/td>\n<\/tr>\n | ||||||
12<\/td>\n | 5.2 Necessary information 5.3 Calculation procedure 5.3.1 General 5.3.2 Determination of the effective cooling surface Ae of the enclosure 5.3.3 Determination of the internal temperature-rise \u0394t0,5 of the air at mid-height of the enclosure <\/td>\n<\/tr>\n | ||||||
13<\/td>\n | 5.3.4 Determination of the internal temperature-rise \u0394t1,0 of air at the top of the enclosure 5.3.5 Characteristic curve for temperature-rise of air inside enclosure <\/td>\n<\/tr>\n | ||||||
14<\/td>\n | Figures Figure 1 \u2013 Temperature-rise characteristic curve for enclosures with Ae exceeding 1,25 m2 <\/td>\n<\/tr>\n | ||||||
15<\/td>\n | 5.4 Maximum internal air temperature limits 6 Further considerations 6.1 General 6.2 Guidance on the effects of an uneven power distribution Figure 2 \u2013 Temperature-rise characteristic curve for enclosures with Ae not exceeding 1,25 m2 <\/td>\n<\/tr>\n | ||||||
16<\/td>\n | 6.3 Guidance on the additional temperature-rise effect due to solar radiation <\/td>\n<\/tr>\n | ||||||
17<\/td>\n | 7 Evaluation of the design Tables Table 1 \u2013 Method of calculation, application, formulas and characteristics <\/td>\n<\/tr>\n | ||||||
18<\/td>\n | Table 2 \u2013 Symbols, units and designations <\/td>\n<\/tr>\n | ||||||
19<\/td>\n | Table 3 \u2013 Surface factor b according to the type of installation Table 4 \u2013 Factor d for enclosures without ventilation openings and with an effective cooling surface Ae > 1,25 m2 Table 5 \u2013 Factor d for enclosures with ventilation openings and an effective cooling surface Ae > 1,25 m2 <\/td>\n<\/tr>\n | ||||||
20<\/td>\n | Figure 3 \u2013 Enclosure constant k for enclosures without ventilation openings, with an effective cooling surface Ae > 1,25 m2 Table 6 \u2013 Equation for Figure 3 <\/td>\n<\/tr>\n | ||||||
21<\/td>\n | Figure 4 \u2013 Temperature distribution factor c for enclosures without ventilation openings and with an effective cooling surface Ae > 1,25 m2 Table 7 \u2013 Equations for Figure 4 <\/td>\n<\/tr>\n | ||||||
22<\/td>\n | Figure 5 \u2013 Enclosure constant k for enclosures with ventilation openings and an effective cooling surface Ae > 1,25 m2 Table 8 \u2013 Equations for Figure 5 <\/td>\n<\/tr>\n | ||||||
23<\/td>\n | Figure 6 \u2013 Temperature distribution factor c for enclosures with ventilation openings and an effective cooling surface Ae > 1,25 m2 <\/td>\n<\/tr>\n | ||||||
24<\/td>\n | Figure 7 \u2013 Enclosure constant k for enclosures without ventilation openings and with an effective cooling surface Ae \u2264 1,25 m2 Table 9 \u2013 Equations for Figure 6 <\/td>\n<\/tr>\n | ||||||
25<\/td>\n | Figure 8 \u2013 Temperature distribution factor c for enclosures without ventilation openings and with an effective cooling surface Ae \u2264 1,25 m2 Table 10 \u2013 Equation for Figure 7 <\/td>\n<\/tr>\n | ||||||
26<\/td>\n | Table 11 \u2013 Equation for Figure 8 <\/td>\n<\/tr>\n | ||||||
27<\/td>\n | Figure 9 \u2013 Calculation of temperature-rise of air inside enclosures <\/td>\n<\/tr>\n | ||||||
28<\/td>\n | Annexes Annex A (informative) Examples for the calculation of the temperature-rise of air inside enclosures A.1 Example 1 Figure A.1 \u2013 Example 1, calculation for an enclosure with exposed side faces without ventilation openings and without internal horizontal partitions <\/td>\n<\/tr>\n | ||||||
30<\/td>\n | Figure A.2 \u2013 Example 1, calculation for a single enclosure <\/td>\n<\/tr>\n | ||||||
31<\/td>\n | A.2 Example 2 Figure A.3 \u2013 Example 2, calculation for an enclosure for wall-mounting with ventilation openings <\/td>\n<\/tr>\n | ||||||
32<\/td>\n | Figure A.4 \u2013 Example 2, calculation for one enclosure half <\/td>\n<\/tr>\n | ||||||
34<\/td>\n | Figure A.5 \u2013 Example 2, calculation for an enclosure for wall-mounting with ventilation openings <\/td>\n<\/tr>\n | ||||||
35<\/td>\n | Annex B (informative) Guidance on the effects of an uneven power distribution B.1 Horizontal partition B.2 Calculation of internal air temperature-rise for assemblies with ventilation openings with even power distribution and less than 50 % perforation in horizontal partitions Figure B.1 \u2013 Examples of assemblies with horizontal partitions <\/td>\n<\/tr>\n | ||||||
36<\/td>\n | B.3 Calculation of internal air temperature-rise with an uneven power distribution Figure B.2 \u2013 Temperature-rise verification of a higher-power circuit <\/td>\n<\/tr>\n | ||||||
37<\/td>\n | Annex C (informative) Guidance on the additional temperature-rise effect due to solar radiation C.1 General C.2 Solar radiation phenomena Figure C.1 \u2013 Solar radiation phenomena <\/td>\n<\/tr>\n | ||||||
38<\/td>\n | C.3 Solar radiation \u2013 consequences for thermal calculation Figure C.2 \u2013 Interpolation curve Table C.1 \u2013 Approximate solar absorption radiation coefficients (according to colour) <\/td>\n<\/tr>\n | ||||||
39<\/td>\n | C.4 Solar radiation of enclosures with air ventilation openings <\/td>\n<\/tr>\n | ||||||
40<\/td>\n | Annex D (informative) Guidance on the effect of different enclosure materials, construction and finishes D.1 General D.2 Validity criteria D.3 Material of enclosure D.4 Results <\/td>\n<\/tr>\n | ||||||
41<\/td>\n | Figure D.1 \u2013 Results of comparison tests <\/td>\n<\/tr>\n | ||||||
42<\/td>\n | Annex E (informative) Guidance on the effects of different natural ventilation arrangements Figure E.1 \u2013 Examples of crossing diagonal installation <\/td>\n<\/tr>\n | ||||||
43<\/td>\n | Figure E.2 \u2013 Effect of additional filters <\/td>\n<\/tr>\n | ||||||
44<\/td>\n | Annex F (informative) Guidance on forced ventilation management F.1 General F.2 Forced ventilation installation system F.3 Installation considerations <\/td>\n<\/tr>\n | ||||||
45<\/td>\n | Figure F.1 \u2013 Examples of forced ventilation arrangements <\/td>\n<\/tr>\n | ||||||
46<\/td>\n | Annex G (informative) Power loss values calculation G.1 General G.2 Power losses of low-voltage switchgear and controlgear G.3 Power losses of conductors connecting low-voltage switchgear and controlgear <\/td>\n<\/tr>\n | ||||||
47<\/td>\n | G.4 Power losses of busbars G.5 Power losses of electronic devices <\/td>\n<\/tr>\n | ||||||
48<\/td>\n | Annex H (informative) Guidance on the impact of an adjacent wallon the assembly cooling surfaces Figure H.1 \u2013 Wall-mounted assembly <\/td>\n<\/tr>\n | ||||||
49<\/td>\n | Figure H.2 \u2013 Floor-standing assembly <\/td>\n<\/tr>\n | ||||||
50<\/td>\n | Annex I (informative) Operating current and power loss of copper conductors <\/td>\n<\/tr>\n | ||||||
51<\/td>\n | Table I.1 \u2013 Operating current and power loss of single-core copper cables with a permissible conductor temperature of 70 \u00b0C (ambient temperature insidethe enclosure: 55 \u00b0C) <\/td>\n<\/tr>\n | ||||||
52<\/td>\n | Table I.2 \u2013 Reduction factor k1 for cables with a permissible conductor temperature of 70 \u00b0C (extract from IEC 60364-5-52:2009, Table B.52.14) <\/td>\n<\/tr>\n | ||||||
53<\/td>\n | Table I.3 \u2013 Operating current and power loss of bare copper bars with rectangular cross-section, run horizontally and arranged with their largest face vertical, for DC and AC frequencies 16 2\/3 Hz, 50 Hz to 60 Hz (ambient temperature inside the enclosure: 55 \u00b0C, temperature of the conductor 70 \u00b0C) <\/td>\n<\/tr>\n | ||||||
54<\/td>\n | Table I.4 \u2013 Factor k4 for different temperatures ofthe air inside the enclosure and\/or for the conductors <\/td>\n<\/tr>\n | ||||||
55<\/td>\n | Annex J (informative) Guidance to magnetic and eddy-current power losses Figure J.1 \u2013 Power losses distribution for differentgland plates with the same rating <\/td>\n<\/tr>\n | ||||||
56<\/td>\n | Annex K (informative) Forced ventilation airflow calculation K.1 General <\/td>\n<\/tr>\n | ||||||
57<\/td>\n | K.2 Ventilation airflow calculation Table K.1 \u2013 Factor k for altitudes above sea level <\/td>\n<\/tr>\n | ||||||
59<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" A method of temperature-rise verification of low-voltage switchgear and controlgear assemblies by calculation<\/b><\/p>\n |