IEC 62951-5:2019 specifies the test method for thermal characteristics of flexible materials. This document includes terms, definitions, symbols, and test methods that can be used to evaluate and determine thermal characteristics of flexible materials for practical use. The measurement method relies on non-contact optical thermometry that is based on temperature dependent optical reflectance. This document is applicable to both substrate and thin-film flexible semiconductor materials that are subjected to bending and stretching.<\/p>\n
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| 2<\/td>\n | undefined <\/td>\n<\/tr>\n | ||||||
| 4<\/td>\n | English CONTENTS <\/td>\n<\/tr>\n | ||||||
| 5<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
| 7<\/td>\n | 1 Scope 2 Normative references 3 Terms and definitions <\/td>\n<\/tr>\n | ||||||
| 8<\/td>\n | 4 Testing method 4.1 General <\/td>\n<\/tr>\n | ||||||
| 9<\/td>\n | 4.2 Test apparatus Figures Figure 1 \u2013 Thermoreflectance signals of substrate and thin-film materials as functions of temperature Figure 2 \u2013 Reflectance vs. temperature of silicon thin-films (thicknesses of1,62 \u03bcm, 1,64 \u03bcm, and 1,67 \u03bcm) for the wavelength of 633 nm <\/td>\n<\/tr>\n | ||||||
| 10<\/td>\n | Figure 3 \u2013 Schematic of thermoreflectance thermometry with one laser source that is used for calibration <\/td>\n<\/tr>\n | ||||||
| 11<\/td>\n | Figure 4 \u2013 Schematic of thermoreflectance thermometry with one laser sourcethat is used for measurement <\/td>\n<\/tr>\n | ||||||
| 12<\/td>\n | Figure 5 \u2013 Schematic of thermoreflectance thermometry with two lasers ofdifferent wavelengths used for calibration <\/td>\n<\/tr>\n | ||||||
| 13<\/td>\n | Figure 6 \u2013 Schematic of thermoreflectance thermometry with two lasers ofdifferent wavelengths used for measurement <\/td>\n<\/tr>\n | ||||||
| 14<\/td>\n | Figure 7 \u2013 Optical reflectance of a silicon thin-film (1,526 \u03bcm) at 532 nm and 633 nmas a function of temperature Figure 8 \u2013 Reflectance ratio of a silicon thin-film as a function of temperature (\u03bb1 = 633 nm and \u03bb2 = 532 nm) <\/td>\n<\/tr>\n | ||||||
| 15<\/td>\n | 4.3 Test procedures 4.3.1 General 4.3.2 Substrate specimen Figure 9 \u2013 Suspended bending or uniaxial stretching of flexible orstretchable semiconductor materials <\/td>\n<\/tr>\n | ||||||
| 16<\/td>\n | 4.3.3 Thin-film specimen 4.4 Report of results <\/td>\n<\/tr>\n | ||||||
| 17<\/td>\n | Annex A (informative)Example of 3D design of thermoreflectance thermometry Figure A.1 \u2013 3D design of dual wavelength thermoreflectance setup <\/td>\n<\/tr>\n | ||||||
| 18<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Semiconductor devices. Flexible and stretchable semiconductor devices – Test method for thermal characteristics of flexible materials<\/b><\/p>\n |