{"id":372293,"date":"2024-10-20T02:28:37","date_gmt":"2024-10-20T02:28:37","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-iec-61188-6-22021\/"},"modified":"2024-10-26T04:18:55","modified_gmt":"2024-10-26T04:18:55","slug":"bs-en-iec-61188-6-22021","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-iec-61188-6-22021\/","title":{"rendered":"BS EN IEC 61188-6-2:2021"},"content":{"rendered":"

IEC 61188-6-2:2021 describes the requirements of design and use for soldering surfaces of land pattern on circuit boards. This document includes land pattern for surface mounted components. These requirements are based on the solder joint requirements of IEC 61191\u20112:2017.<\/p>\n

PDF Catalog<\/h4>\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
PDF Pages<\/th>\nPDF Title<\/th>\n<\/tr>\n
2<\/td>\nundefined <\/td>\n<\/tr>\n
5<\/td>\nAnnex ZA(normative)Normative references to international publications with their corresponding European publications <\/td>\n<\/tr>\n
7<\/td>\nEnglish
CONTENTS <\/td>\n<\/tr>\n
9<\/td>\nFOREWORD <\/td>\n<\/tr>\n
11<\/td>\n1 Scope
2 Normative references
3 Terms and definitions
4 Kinds of target solder process
5 Land pattern determination <\/td>\n<\/tr>\n
12<\/td>\n6 Requirements
6.1 General requirements
6.2 The proposed land pattern dimension system
6.2.1 Land pattern design <\/td>\n<\/tr>\n
13<\/td>\n6.2.2 Solder joint fillet design <\/td>\n<\/tr>\n
14<\/td>\nFigures
Figure 1 \u2013 Example of the dimensional relationship between the drawings ofcomponents with rectangular terminals and the land pattern design <\/td>\n<\/tr>\n
15<\/td>\n6.2.3 Courtyard excess
6.2.4 Rounding factor
6.2.5 Relationship between terminal classifications and class of land pattern
6.2.6 Terminal types
Tables
Table 1 \u2013 Relationship between terminal classifications and class of land pattern <\/td>\n<\/tr>\n
16<\/td>\nFigure 2 \u2013 Definitions of dimensions of the flat bottom terminal types <\/td>\n<\/tr>\n
19<\/td>\n6.3 Land pattern for wave soldering
6.3.1 General
6.3.2 Flat bottom terminals
6.3.3 Flat bottom and vertical side terminals
Figure 3 \u2013 Definitions of dimensions of the flat bottom and vertical side terminal types
Table 2 \u2013 Conformity to the wave soldering of the terminal types <\/td>\n<\/tr>\n
20<\/td>\n6.4 Land pattern for reflow soldering
6.4.1 General
6.4.2 Flat bottom terminals
6.4.3 Flat bottom and vertical side terminals
Table 3 \u2013 Land pattern dimensions for Flat bottom terminals soldered by reflow soldering <\/td>\n<\/tr>\n
21<\/td>\n6.4.4 Remarks
Table 4 \u2013 Land pattern dimensions for flat bottom and vertical side terminals soldered by reflow soldering <\/td>\n<\/tr>\n
22<\/td>\nFigure 4 \u2013 Solder touches image <\/td>\n<\/tr>\n
23<\/td>\nFigure 5 \u2013 Unacceptable conditions for overhangs <\/td>\n<\/tr>\n
24<\/td>\nAnnex A (informative) The relation between terminal type and component packages
A.1 Flat bottom terminals
A.2 Flat bottom and vertical side terminals
Table A.1 \u2013 Terminal type classifications 1 \u2013 Flat bottom terminals <\/td>\n<\/tr>\n
25<\/td>\nTable A.2 \u2013 Terminal type classifications 2 \u2013 Flat bottom and vertical side terminals <\/td>\n<\/tr>\n
27<\/td>\nAnnex B (informative)Solder joint fillet designs for wave soldering
Table B.1 \u2013 Solder joint fillet design for wave soldering <\/td>\n<\/tr>\n
28<\/td>\nAnnex C (informative)Courtyard excess for reflow soldering
C.1 Courtyard excess for flat bottom terminals to use the land pattern for reflow soldering
C.2 Courtyard excess for flat bottom and vertical side terminals to use the land pattern for reflow soldering
Table C.1 \u2013 Courtyard excess for flat bottom terminals to use the land pattern for reflow soldering <\/td>\n<\/tr>\n
29<\/td>\nTable C.2 \u2013 Courtyard excess for flat bottom and vertical side terminals to use the land pattern for reflow soldering <\/td>\n<\/tr>\n
30<\/td>\nBibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"

Circuit boards and circuit board assemblies. Design and use – Land pattern design. Description of land pattern for the most common surface mounted components (SMD)<\/b><\/p>\n\n\n\n\n
Published By<\/td>\nPublication Date<\/td>\nNumber of Pages<\/td>\n<\/tr>\n
BSI<\/b><\/a><\/td>\n2021<\/td>\n32<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"featured_media":372303,"template":"","meta":{"rank_math_lock_modified_date":false,"ep_exclude_from_search":false},"product_cat":[2641],"product_tag":[],"class_list":{"0":"post-372293","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-bsi","8":"first","9":"instock","10":"sold-individually","11":"shipping-taxable","12":"purchasable","13":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product\/372293","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media\/372303"}],"wp:attachment":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media?parent=372293"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_cat?post=372293"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_tag?post=372293"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}